Substrate connection process and substrate assembly of LED automobile headlamp

A technology for substrates and headlights, applied in connection, motor vehicles, road vehicles, etc., can solve problems such as labor-intensive, time-consuming connection between substrates and substrates, low product consistency, etc., and achieve uniform specifications and high product consistency.

Active Publication Date: 2018-10-12
SHENZHEN YIKE PHOTOELECTRIC TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In order to solve the above-mentioned problems in the prior art, the present invention provides a substrate connection process for LED automotive headlights, which can solve the problems of time-consuming, labor-intensive, ...

Method used

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  • Substrate connection process and substrate assembly of LED automobile headlamp
  • Substrate connection process and substrate assembly of LED automobile headlamp
  • Substrate connection process and substrate assembly of LED automobile headlamp

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Embodiment Construction

[0031] In order to better explain the present invention and facilitate understanding, the present invention will be described in detail below through specific embodiments in conjunction with the accompanying drawings.

[0032] The invention provides a substrate connection process for LED automotive headlights, such as figure 1 and figure 2 As shown, it includes the following steps: A, setting the first substrate 1 and the second substrate 2 to be connected, the first substrate 1 includes the first pad 11, and the second substrate 2 includes the second pad 21; B, setting the flexible Substrate 3, flexible substrate 3 includes the third pad 31 and the fourth pad 32 electrically connected by means of substrate wiring; C, make the first pad 11 and the third pad 31 align and solder, the second pad 21 and the fourth pad 32 are aligned and soldered.

[0033] Preferably, before step C, solder paste is brushed on the first pad 11 and / or the third pad 31 , and solder paste is brushed...

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Abstract

The invention relates to the technical field of LED automobile headlamp manufacturing, in particular to a substrate connection process of an LED automobile headlamp. The substrate connection process comprises the following steps of A, arranging a first substrate to be connected and a second substrate to be connected, wherein the first substrate comprises a first bonding pad, and the second substrate comprises a second bonding pad; B, arranging a flexible substrate, wherein the flexible substrate comprises a third bonding pad and a fourth bonding pad, and the third bonding pad and the fourth bonding pad are electrically connected by a substrate wire; and C, allowing the first bonding pad and the second bonding pad to be aligned and welded, and allowing the second bonding pad and the fourthbonding pad to be aligned and welded. By the process, the problems of time and labor consumption of connection between the substrates in the prior art and low product consistency can be solved, and production is facilitated. The invention also provides a substrate assembly of the LED automobile headlamp.

Description

technical field [0001] The invention relates to the technical field of manufacturing LED automobile headlights, in particular to a substrate connection process for LED automobile headlights and a substrate assembly manufactured by using the substrate connection process for LED automobile headlights. Background technique [0002] At present, most of the known LED automotive headlight industries use copper substrates, aluminum substrates or PCBs (printed circuit boards) as the fixing and thermal and conductive media of LED lamp beads, and the substrates are collectively referred to below. The LED lamp beads in the LED car headlights conduct electricity with the help of the lines on the substrate, and the heat generated by the LED lamp beads is conducted through the substrate to other heat conduction channels with high thermal conductivity. However, the commonly used substrates cannot be bent at large angles due to the characteristics of their materials. Theoretically, the maxi...

Claims

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Application Information

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IPC IPC(8): H01R43/02F21V19/00F21W102/13F21W107/10F21Y115/10
CPCF21V19/0025F21W2102/13F21W2107/10F21Y2115/10H01R43/0256H01R43/0263
Inventor 张鹏
Owner SHENZHEN YIKE PHOTOELECTRIC TECH
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