Manufacturing method of printed circuit board and printed circuit board

Abstract

The present invention provides a manufacturing method of a printed circuit board and a printed circuit board. According to the manufacturing method of the printed circuit board, after a first core board is patternized, a first hole is formed at the predetermined position of the first core board by means of drilling; the first hole is filled with a decomposable material; the first core board and the other core board are laminated, and a second hole is formed at the same position with the first hole; the diameter of the first hole is larger than the diameter of the second hole, so that after thedrilling of the second hole is completed, the decomposable material is still left on the hole wall of the first core boar, and therefore, palladium can be deposited on the decomposable material afterpalladium activation treatment is carried out in a PTH process; and after the decomposable material is decomposed, the palladium is removed, so that a copper layer cannot be formed on the surface ofthe hole wall of the first core board during copper deposition and copper electroplating.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a printed circuit board and the printed circuit board. Background technique [0002] At present, with the development of communication technology, communication electronic products have higher and higher requirements for signals. The update of each generation of products requires the technical support of the printed circuit board process, and it also poses a huge challenge to the printed circuit board industry. In the through-hole design of the printed circuit board, there are often some redundant paths that are invalid for signal transmission, and these paths have a significant impact on signal loss. In related technologies, such as figure 1 with figure 2 As shown, in order to solve such problems of the printed circuit board 10', the copper skin 20' on the invalid path in the through hole is mainly cut off by back drilling, so as to ...

AI Technical Summary

Problems solved by technology

[0003] However, there are still many disadvantages in the back drilling process.

For example, the uneven thickness of the board makes it difficult to process, and it is difficult to accurately control the depth; the back drilling is not thorough, and the residual copper skin will still affect the signal transmission quality; there is a risk of drilling through the conduction layer, and the product yield is greatly affected by it. Large; back drilling will cause semi-destructive structure to the hole, so that the hole will be unevenly stressed in the environment affected by thermal stress such as reflow soldering, which will easily cause the reliability failure of the local position

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