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Isolated heat dissipation structure suitable for charging pile module and heat dissipation method thereof

A heat dissipation structure and isolation technology, applied in the modification of power electronics, electrical equipment structural parts, electrical components, etc., can solve the problem that the heat dissipation structure is easy to damage the internal structure of the charging pile module, etc., to achieve thermal balance, improve product quality Reliability, avoidance of damage by harmful substances

Inactive Publication Date: 2018-10-23
SHENZHEN POWERINGEV TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that the current heat dissipation structure and method of the charging pile module are easy to damage the internal structure of the charging pile module, and provide an isolated heat dissipation structure and heat dissipation method suitable for the charging pile module

Method used

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  • Isolated heat dissipation structure suitable for charging pile module and heat dissipation method thereof
  • Isolated heat dissipation structure suitable for charging pile module and heat dissipation method thereof
  • Isolated heat dissipation structure suitable for charging pile module and heat dissipation method thereof

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Embodiment Construction

[0021] The present invention will be further described below in conjunction with accompanying drawing and specific embodiment:

[0022] Such as figure 1 , figure 2 , image 3 As shown, an isolated heat dissipation structure suitable for charging pile modules includes a housing 1, a PCB board module 2, a heat sink module 3 with water channels, a water-cooled and air-cooled heat dissipation module 4, and a coolant pipe 5. One side of the housing 1 is provided with a PCB board module 2, and the other side of the housing 1 is provided with a water-cooled and air-cooled heat dissipation module 4, and one side of the PCB board module 2 is attached to a heat sink module 3 with a water channel The heat sink module 3 with a water channel is connected to the water-cooled and air-cooled heat dissipation module 4 through a coolant pipe 5, and an air channel 8 or a side surface of the housing 1 is formed between the housing 1 and at least one side of the PCB board module 2 The opening ...

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Abstract

The invention provides an isolated heat dissipation structure suitable for a charging pile module. The isolated heat dissipation structure comprises a casing, a PCB module, a heat sink module with a water channel, a water cooling and air cooling module, and a cooling liquid pipe. The PCB module is disposed on a side in the casing. The water cooling and air cooling module is disposed on the other side in the casing. The heat sink module with a water channel is attached to one side of the PCB module and is connected with the water cooling and air cooling module through the cooling liquid pipe. An air channel is formed between the casing and at least one side of the PCB module or a hole on the side of the casing forms the air channel. All heat dissipating components are assembled integrally so as to be easy to install. By the air channel, the contact area of the heat-dissipating airflow in the air channel and the casing is increased. The isolated air channel design prevents the air from flowing through the PCB and power components so as to protect the PCB board and the components thereon and prevent the PCB board and the components thereon from being damaged by harmful substances in the air, and improve product reliability.

Description

【Technical field】 [0001] The invention relates to a heat dissipation structure of a charging pile module and a heat dissipation method thereof, in particular to an isolated heat dissipation structure suitable for a charging pile module and a heat dissipation method thereof. 【Background technique】 [0002] At present, the charging pile module mainly uses direct air cooling to dissipate heat. The fan directly blows the ambient air to the PCB board, heating elements and heat sinks, and directly dissipates heat through heat exchange with the air. This heat dissipation structure and method have the following deficiencies: 1. The ambient air directly Contact with the inside of the product will cause dust accumulation, long-term use will change the air duct, the cooling effect of the product will deteriorate, and affect the work of the product; 2. The ambient air will contain many highly corrosive substances, such as sulfide and high-salt fog air. Acidic substances, etc., will corr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/209H05K7/20909H05K7/20927
Inventor 程明
Owner SHENZHEN POWERINGEV TECH CO LTD
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