Grinding wheel capable of easily removing chips

A grinding wheel and substrate technology, applied in the field of grinding wheels, can solve the problems of heat dissipation effect, accelerated grinding wheel wear, accumulation of wear debris, etc., and achieve the effects of facilitating safe production, increasing chip removal channels, and increasing heat dissipation area

Inactive Publication Date: 2018-10-26
刘雪松
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In engineering use, when the grinding wheel is grinding or cutting materials, the grinding contact area between the grinding wheel and the workpiece is large, and the grinding heat is difficult to discharge in time, thus forming a local high temperature on the grinding surface, causing problems such as burns and cracks on the surface of the workpiece, which are serious It affects the surface processing quality of the workpiece, and accelerates the wear of the grinding wheel, which restricts the further popularization and application of grinding technology
In addition, after the grinding wheel has been used for a period of time, if a local wear defect occurs, the entire grinding wheel needs to be replaced, resulting in serious waste
[0003] Application number 201521112770.1 discloses a grinding wheel with chip removal grooves, which has multiple chip removal grooves radially on the side where the abrasive layer is in contact with the workpiece, but its chip removal capacity is not ideal enough, and the bottom of the chip removal grooves For rectangular corners, it is easy to cause accumulation of wear debris and affect the effect of chip removal
Application No. 201020166002.5 discloses a grinding wheel that is easy to dissipate heat. The adopted technical solution is to connect the aluminum core through the hole in the center of the grinding wheel disc body and design annular grooves on the upper and lower surfaces of the disc body for heat dissipation, but the heat dissipation effect is not very satisfactory. There is no relationship between the grooves, which will affect the heat dissipation effect, and it will easily cause abrasive debris filling and poor chip removal, scratching the surface of the workpiece

Method used

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  • Grinding wheel capable of easily removing chips
  • Grinding wheel capable of easily removing chips
  • Grinding wheel capable of easily removing chips

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Embodiment Construction

[0030] The technical solutions of the various embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts fall within the protection scope of the present invention.

[0031] Such as figure 1 , figure 2 As shown, there is provided an easy chip removal grinding wheel, comprising a grinding wheel base 1, a mounting shaft hole 5 is opened at the center of the grinding wheel base 1, an abrasive layer 2 is provided on one side of the grinding wheel base 1, and the The central position of the abrasive material layer 2 is provided with a relief installation hole 6 corresponding to the installation shaft hole 5, and the end surface of the abrasive mat...

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Abstract

The invention discloses a grinding wheel capable of easily removing chips. The grinding wheel comprises a grinding wheel substrate; a mounting shaft hole is formed in the center of the grinding wheelsubstrate; a material grinding layer is disposed on one side of the grinding wheel substrate; a receding mounting hole which corresponds to the mounting shaft hole is formed in the center of the material grinding layer; a plurality of protruding edges are radially disposed on the end surface, making contact with a workpiece, of the material grinding layer and are uniformly distributed on the mentioned end surface; radial-extending arc-shaped grooves are formed between the protruding edges and formed in the material grinding layer; bosses are disposed on the protruding edges; and inwards-concave grooves which are embedded into the bosses are formed in the end surface, making contact with the workpiece, of the material grinding layer. By means of the structure with the protruding edges and the arc-shaped grooves, the chip removing capacity and the heat dissipation capacity of the grinding wheel can be effectively improved, the grinding accuracy of the grinding wheel is improved, and theservice life of the grinding wheel is prolonged.

Description

technical field [0001] The invention relates to the technical field of grinding wheels, in particular to an easy chip removal grinding wheel. Background technique [0002] At present, the commonly used shapes of grinding wheels include parallel grinding wheel, single concave grinding wheel, double-sided concave grinding wheel, thin slice grinding wheel, cylindrical grinding wheel, bowl-shaped grinding wheel, butterfly grinding wheel and so on. In engineering use, when the grinding wheel is grinding or cutting materials, the grinding contact area between the grinding wheel and the workpiece is large, and the grinding heat is difficult to discharge in time, thus forming a local high temperature on the grinding surface, causing problems such as burns and cracks on the surface of the workpiece, which are serious It affects the surface processing quality of the workpiece, and accelerates the wear of the grinding wheel, which restricts the further popularization and application of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D7/02B24D7/10
CPCB24D7/02B24D7/10
Inventor 刘雪松
Owner 刘雪松
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