Buffer material and hot-pressing process
A technology of hot pressing process and buffer material, which is applied in lamination, lamination device, control lamination, etc. It can solve problems such as difficult to find problems in time, affect the efficiency of hot pressing operations, and easily increase the number of defective products, so as to avoid downtime , improve the efficiency of hot pressing operations, and avoid the effect of poor production
Active Publication Date: 2018-10-30
BOE TECH GRP CO LTD +1
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0005] The sampling inspection method of the existing technology not only affects the efficiency of hot pressing operations, but also makes it difficult to find problems in time, which easily increases the number of defective products
Method used
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[0044] Unless otherwise defined, all technical terms used in the embodiments of the present invention have the same meaning as commonly understood by those skilled in the art. In order to make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be described in further detail below in conjunction with the accompanying drawings.
[0045] On the one hand, the embodiment of the present invention provides a buffer material, as attached figure 1 As shown, the buffer material includes: a buffer layer 1 and a pressure sensitive layer 2 overlapped with the bottom of the buffer layer 1.
[0046] Among them, the pressure-sensitive layer 2 is used for color development under pressure, and the color development intensity formed under different pressures is different.
[0047] The buffer material provided by the embodiment of the present invention can be used in the hot pressing process. When used, as attached figure ...
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Abstract
The invention discloses a buffer material and a hot-pressing process, and belongs to the field of a hot-pressing process. The buffer material comprises a buffer layer and a pressure sensing layer; thebottom of the buffer layer and the pressure sensing layer are superposed; the pressure sensing layer is used for developing under a pressure applying state, the formed developing intensity is different under different pressures. The buffer material can be applied to the hot-pressing process, and a developing layer in the pressure sensing layer can develop under the pressure applying state to formimpress with color. The developing intensity is different under different pressures, so that the color of the impress can be changed under different pressures. Whether a hot-pressing cutting head isfat or not is judged by monitoring the shade of the color of the impress. Based on the buffer material, the flatness of the hot-pressing cutting head and the damage condition of the buffer layer can be monitored in real time in the hot-pressing process, the problem can be discovered timely and bad production is avoided. In addition, halt of hot-pressing equipment is avoided, and the hot-pressing operation efficiency is improved.
Description
Technical field [0001] The invention relates to the field of hot pressing technology, in particular to a buffer material and a hot pressing technology. Background technique [0002] Hot pressing (also known as bonding) is used for mechanical and electrical connections between flexible components and other components. For example, when the anisotropic conductive film (Anisotropic Conductive Film, ACF) is attached, the anisotropic conductive film is placed between two components, and the component with the anisotropic conductive film is placed on top of the The heat-conducting buffer layer allows the hot pressing tool head of the hot pressing equipment to directly press the buffer layer. The buffer layer can not only buffer the pressure from the hot pressing tool head and prevent damage to the components, but also enable the heat from the hot pressing tool head to be smoothly transferred to the anisotropic conductive film. [0003] When the buffer layer is damaged, or the flatness ...
Claims
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Login to View More IPC IPC(8): B32B25/08B32B25/20B32B27/06B32B27/36B32B3/26B32B25/06B32B29/00B32B37/06B32B37/10B32B41/00G01L1/24G01N3/18
CPCB32B3/26B32B25/06B32B25/08B32B25/20B32B27/06B32B27/36B32B29/002B32B37/06B32B37/10B32B41/00G01L1/24G01N3/18
Inventor 沈福龙吴恩龙郝显尹杰柳杰陈伟明
Owner BOE TECH GRP CO LTD