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Full-automatic IC programmer

A burning machine, fully automatic technology, applied in the direction of conveyor objects, transportation and packaging, can solve problems such as affecting efficiency, affecting burning efficiency, low efficiency, etc., to improve burning efficiency, simple control procedures, and improve the overall The effect of efficiency

Pending Publication Date: 2018-10-30
SHENZHEN HANJIANG AUTOMATION SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The machine currently on the market has the following defects: 1. The pre-positioning fixture is not used, which will cause inaccurate positioning and affect the programming efficiency;
[0004] 2. Each programming cycle process involves many steps such as loading, programming, unloading, and receiving. It is inefficient to wait for each step to be completed before proceeding to the next step;
[0005] 3. For each programming cycle, it is necessary to wait for the multi-station programming fixture to be programmed before picking up the material. The length of the programming time directly affects the efficiency of the whole machine;
[0006] 4. The linear XYZ axis movement manipulator moves frequently, and the failure rate is high, which affects the efficiency

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Such as figure 1 A fully automatic IC programming machine shown includes a loading component 1, a positioning component 2, a programming component 3, a blanking component 4, and a turntable reciprocating manipulator component 5. IC chips are loaded from the loading component 1, After being pre-positioned by the positioning component 2, enter the burning component 3 to complete the burning program, and finally unload through the unloading component 4.

[0034] Wherein, the turntable reciprocating manipulator assembly 5 includes a turntable and three manipulators 50 rotating around the center of the turntable, and each manipulator 50 performs pick-and-place operations for IC chips.

[0035] The material outlet 10 of the loading component, the material inlet and outlet 20 of the positioning component, the material inlet and outlet 30 of the programming component, and the material inlet 40 of the unloading component are evenly arranged along the center of the turntable in s...

Embodiment 2

[0053] On the basis of Embodiment 1, the programming component 3 can also be improved.

[0054] The burning assembly 3 includes a center of rotation, and a plurality of burning stations evenly arranged along the center of rotation, an IC chip carrier 31 is arranged above the burning station, and each IC chip carrier 31 rotates along the The center rotates, and the IC chip falls into the IC chip carrier 31 through the inlet and outlet 30 of the programming assembly, rotates clockwise or counterclockwise along the center of rotation for programming, and finally returns to the inlet and outlet 30 of the programming assembly , to complete the burning program.

[0055] The action process of this technical solution is: after the manipulator 50 puts the IC chip to be burned into the material inlet and outlet 30 of the burning assembly, the IC chip carrier 31 rotates an angle, and the IC chip to be burned is placed on the IC chip carrier 31 Continue the burning program, another blank...

Embodiment 3

[0059] On the basis of Embodiment 1 or 2, the unloading component 4 is preferably equipped with a laser marking function module 6 , a tape sealing module 7 and a tape take-up module 8 .

[0060] Further, the blanking assembly 4 also includes a laser marking functional module 6, and after the IC chip completes the burning program, it enters the laser marking functional module 6 through the material inlet 40 of the blanking assembly to complete laser marking. Such as figure 1 As shown, the laser marking functional module 6 is preferably arranged above the IC chip.

[0061] Further, the blanking assembly 4 also includes a tape sealing module 7. After the IC chip completes the burning program, it enters the tape sealing module 7 through the material inlet 40 of the blanking assembly for braiding and tape sealing, specifically including The carrier tape with the IC chip and the cover tape are pasted and sealed. Such as figure 1 As shown, the tape sealing module 7 is preferably a...

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PUM

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Abstract

A full-automatic IC programmer comprises a feeding assembly, a positioning assembly, a programming assembly, a discharging assembly and a rotating-disc reciprocating manipulator assembly, wherein IC chips are fed from the feeding assembly; after the fed IC chips are prepositioned through the positioning assembly, the prepositioned IC chips enter the programming assembly for being programmed; finally, the programmed IC chips are discharged through the discharging assembly; the rotating-disc reciprocating manipulator assembly comprises a rotating disc and three manipulators; the manipulators perform rotating motion around the center of the rotating disc; each manipulator performs pick-and-place operation on the corresponding IC chip; and when the rotating disc rotates once, the following three actions can be completed at the same time: the IC chip fed by the feeding assembly is transferred to the positioning assembly, the IC chip prepositioned by the positioning assembly is transferred to the programming assembly, and the IC chip programmed by the programming assembly is transferred to the discharging assembly. Compared with the prior art, the full-automatic IC programmer provided bythe invention has the following beneficial effects: (1) by adoption of the positioning assembly, the IC chips can be prepositioned before being programmed, thereby improving the programming efficiency in the later period; and (2) through the rotating-disc reciprocating manipulator assembly, steps involved in the process of each programming cycle can be performed at the same time, thereby greatlyimproving the operation efficiency of the complete full-automatic IC programmer.

Description

technical field [0001] The invention relates to the technical field of programming, in particular to a fully automatic IC programming machine. The invention is mainly used in the programming and curing programs in IC chips, and is suitable for electronic chip industries such as mobile phones, tablet computers, game machines, manipulators, and artificial intelligence. Background technique [0002] At present, the fully automatic IC programming machine for mobile phone IC chips on the market is mainly composed of the following parts: feeding feeder, linear XYZ axis motion manipulator, fixedly arranged multi-station programming fixture and unloading tape closing module , the action can be roughly divided into the following steps: 1. Manually put the IC chip on the feeding station of the feeding feeder; 2. The cylinder of the feeding feeder moves to push the material belt to move, and sends the IC chip to the feeding feeder 3. The linear XYZ-axis motion manipulator takes the ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65G47/90
CPCB65G47/904
Inventor 杨智军徐国根阳承沭
Owner SHENZHEN HANJIANG AUTOMATION SCI & TECH CO LTD
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