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Apparatus and method for processing wafers

A technology of wafers and processing chambers, applied in the field of devices for processing wafers

Active Publication Date: 2021-10-15
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Wafer support is located inside the processing chamber

Method used

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  • Apparatus and method for processing wafers
  • Apparatus and method for processing wafers
  • Apparatus and method for processing wafers

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Embodiment Construction

[0023] The following disclosure provides many different embodiments or examples for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are just examples and not intended to limit the present disclosure. For example, in the illustration, a first feature is formed on or over a second feature, which may include embodiments where the first feature is formed in direct contact with the second feature, which may also include that additional features may be formed on the second feature. An embodiment between a feature and a second feature such that the first feature may not be in direct contact with the second feature. In addition, this disclosure may repeat reference numerals and / or text in various instances. This repetition is for the purposes of brevity and clarity, and is not intended, in itself, to specify a relationship between the various embo...

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Abstract

A device for processing wafers includes: a processing chamber, a wafer support, a heat source and a movable device. A wafer support is located within the processing chamber. A heat source is located within the processing chamber. The movable device is in contact with the heat source, wherein the movable device is movable relative to the wafer support.

Description

technical field [0001] The disclosed embodiments are related to an apparatus for processing wafers, and more particularly to an apparatus and method for processing wafers. Background technique [0002] The fabrication of integrated circuits (ICs) can be driven by increasing the density of integrated circuits formed in semiconductor devices. This is done by implementing more advanced design rules to allow the formation of higher densities of integrated circuit devices. Nonetheless, the increase in the density of integrated circuit devices, such as transistors, has also increased the complexity of handling semiconductor devices with shrinking feature sizes. Contents of the invention [0003] The present disclosure proposes an apparatus for processing wafers, including: a processing chamber, a wafer support, a heat source, and a movable device. A wafer support is located within the processing chamber. The heat source is located in the processing chamber and includes a lamp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/683
CPCH01L21/67011H01L21/67098H01L21/683H01L2221/67H01L2221/683H01L21/67115H01L21/67248H01L21/68742G03B21/20G03B21/2006G03B21/2046H01R33/0854
Inventor 周友华洪敏皓陈冠中
Owner TAIWAN SEMICON MFG CO LTD