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Integrated board and substrate processing device including same

A substrate processing device and integrated board technology, which is applied in the manufacturing of electrical components, circuits, semiconductor/solid-state devices, etc., can solve the problems of spotting and defective substrates on the substrate, and achieve the effect of improving reliability.

Active Publication Date: 2022-04-12
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, during the heating or cooling of the substrate by the integrated board, the temperature deviation of the substrate occurs near the gap between the partition plates, which can cause defects in the substrate.
In particular, during a heat treatment process of heating the substrate using the integrated board, a temperature deviation of the substrate occurring near the gap can cause defects such as spots to occur on the substrate.

Method used

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  • Integrated board and substrate processing device including same
  • Integrated board and substrate processing device including same
  • Integrated board and substrate processing device including same

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Embodiment Construction

[0028] Hereinafter, exemplary embodiments of the present invention will be described. The present invention can be modified variously and can have various forms, and the following will specifically describe examples in the specification. However, the purpose is not to limit the present invention to a specific disclosed form, and it should actually be understood as including all changes, equivalents, and substitutes within the scope of the present invention's thought and technology. When describing each drawing, similar reference numerals are assigned to similar components. Terms such as first and second may be used to describe various constituent elements, but the constituent elements are not limited to the terms. The terms are only used to distinguish one constituent element from other constituent elements. The terms used in the present application are for describing specific examples, and do not limit the present invention. A singular expression also includes a plural exp...

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Abstract

The invention provides an integrated board and a substrate processing device including the same. The substrate processing apparatus may include an integrated board, an ultrasonic wave providing part, a temperature regulating part, and the like. The integrated board may include at least two divided plates disposed adjacent to each other and a cover member capable of absorbing vibrations caused by ultrasonic waves and filling a gap between the divided plates. Therefore, the substrate processing apparatus of the present invention can prevent defects such as spots on the substrate caused by the temperature variation of the substrate due to the gap between the adjacent partition plates.

Description

[0001] This application enjoys the priority of Korean Patent Application No. 2017-0052809 filed with the Korean Intellectual Property Office on April 25, 2017. technical field [0002] The invention relates to an integrated board and a substrate processing device including the same. More specifically, the present invention relates to a manifold capable of changing the temperature of a substrate while the substrate is floating on top, and a substrate processing apparatus including such a manifold. Background technique [0003] Typically, current flat panel display (FPD) devices are fabricated with relatively large area substrates. Part of the process for manufacturing the flat panel display device may be performed in a state where the substrate is floated on top of a plate in order to prevent the substrate from drooping. In order to lift the substrate from the plate, this can be achieved by applying ultrasonic waves to the bottom surface of the substrate. In the case of usi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67011H01L21/67098H01L21/67248
Inventor 金基哲朴奇洪李昌镛崔峰满俞阿敏
Owner SEMES CO LTD