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Electroless copper plating device with cleaning unit

A technology for electroless copper plating and cleaning device, which is applied to chemical instruments and methods, cleaning hollow objects, cleaning methods and utensils, etc., can solve the problems of no cleaning device and low cleaning efficiency in the chemical copper plating device, and achieves good brushing effect. Reasonable structure, unique structure effect

Inactive Publication Date: 2018-11-06
张新雨
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing electroless copper plating device does not have a special cleaning device, and it needs to be cleaned manually, and the cleaning efficiency is low. Therefore, the present invention proposes an electroless copper plating equipment with a cleaning device

Method used

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  • Electroless copper plating device with cleaning unit
  • Electroless copper plating device with cleaning unit
  • Electroless copper plating device with cleaning unit

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Embodiment Construction

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0019] refer to Figure 1-3 , an electroless copper plating equipment with a cleaning device, comprising a base 1, an electroless copper plating pool 7 is fixed in the middle of the top of the base 1, a first installation cylinder 4 is fixed on the top side of the base 1, and the first installation cylinder 4 The inner bottom is equipped with a drive motor 8, the output shaft of the drive motor 8 is fixed with a threaded rod 5 through a coupling, and the upper end of the threaded rod 5 is movably installed on the inner top of the first installation cylinder 4, and the threaded rod 5 is threaded with a The first sliding plate 6, the top of the base 1 away from the sid...

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PUM

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Abstract

The invention discloses an electroless copper plating device with a cleaning unit. The device includes a pedestal. An electroless copper plating tank is fixed to the middle of the top of the pedestal.A first mounting cylinder is fixed to one side of the top of the pedestal, and the inner bottom of the first mounting cylinder is provided with a drive motor. The output shaft of the drive motor is fixed to a screw rod through a coupler. A servo motor is mounted inside a motor base, and the output shaft of the servo motor is fixed to a connection block. Two ends of the connection block are fixedto push-rod motors. One end of each push-rod motor, far from the connection block, is fixed to a vertical rod. The insides of the vertical rods are provided with mounting cavities. Electric heating tubes are mounted in the mounting cavities. One side of each vertical rod, far from the connection block, is fixed to an arc-shaped plate. The bottom of each push-rod motor is fixed to a lifting and descending device. The lower end of each lifting and descending device is fixed to a winding roller. Two guiding wheels are symmetrically fixed to the inner bottom of the electroless copper plating tank.The electroless copper plating device is unique in structure, ingenious in design, reasonable in structure, convenient to clean and suitable for promotion.

Description

technical field [0001] The invention relates to the technical field of copper plating, in particular to an electroless copper plating equipment with a cleaning device. Background technique [0002] Electroless copper plating is a process in circuit board manufacturing, usually also called copper sinking or porosity (PTH), which is an autocatalytic redox reaction. First, it is treated with an activator to make a layer of active particles adsorb on the surface of the insulating substrate. Usually, metal palladium particles are used (palladium is a very expensive metal, and the price is high and has been rising. In order to reduce costs, there are practical colloids abroad. Copper process is running), copper ions are first reduced on these active metal palladium particles, and these reduced metal copper crystal nuclei themselves become the catalytic layer of copper ions, so that the reduction reaction of copper continues in these new copper crystals on the nuclear surface. El...

Claims

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Application Information

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IPC IPC(8): C23C18/38B08B9/087
CPCB08B9/087C23C18/38
Inventor 张新雨
Owner 张新雨
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