Electroless copper plating device with cleaning unit
A technology for electroless copper plating and cleaning device, which is applied to chemical instruments and methods, cleaning hollow objects, cleaning methods and utensils, etc., can solve the problems of no cleaning device and low cleaning efficiency in the chemical copper plating device, and achieves good brushing effect. Reasonable structure, unique structure effect
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[0018] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.
[0019] Reference Figure 1-3 , A chemical copper plating equipment with a cleaning device, including a base 1, a chemical copper plating bath 7 is fixed at the top middle of the base 1, a first mounting cylinder 4 is fixed on the top side of the base 1, and a first mounting cylinder 4 A drive motor 8 is installed at the inner bottom, the output shaft of the drive motor 8 is fixed with a threaded rod 5 through a coupling, and the upper end of the threaded rod 5 is movably mounted on the inner top of the first mounting cylinder 4, and the threaded rod 5 is threaded with On the first sliding plate 6, a second mounting cylinder 17 is fixed on t...
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