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A kind of preparation method of differential pressure sensor

A pressure sensor and device layer technology, applied in the field of micro-electromechanical system manufacturing, can solve the problems of poor linearity and reliability of pressure-sensitive films, and achieve the effects of improving linearity and reliability and increasing thickness

Active Publication Date: 2021-02-02
MEMSENSING MICROSYST SUZHOU CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of this, the present invention is committed to providing a preparation method of a differential pressure sensor to solve the problem of poor linearity and reliability when the pressure sensitive film of the differential pressure sensor is thin

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  • A kind of preparation method of differential pressure sensor
  • A kind of preparation method of differential pressure sensor
  • A kind of preparation method of differential pressure sensor

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Embodiment Construction

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0021] Differential pressure sensors include three performance indicators: sensitivity, linearity and reliability. Sensitivity refers to the ratio of the output change △y to the input change △x of the differential pressure sensor under steady-state working conditions, that is, the sensitivity of the output to the change of the input. When the pressure-sensitive film is thinner, the The larger the deformation, the more sensitive the differential pressu...

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Abstract

The invention discloses a preparation method of a differential pressure sensor, which solves the problems of poor linearity and reliability when the pressure sensitive film is thin. The preparation method includes: preparing an insulator wafer with a cavity, the insulator wafer with a cavity includes a device layer, an oxide layer and a substrate layer stacked in sequence, and the substrate layer and the oxide layer include a layer located in the substrate layer the annular cavity; prepare piezoresistors on the surface of the device layer; etch away part of the substrate layer within the range of the orthographic projection of the annular cavity to expose the annular cavity.

Description

technical field [0001] The invention relates to the technical field of micro-electromechanical system manufacturing, in particular to a method for preparing a differential pressure sensor. Background technique [0002] Pressure sensor is one of the earliest appearance and application products of micro-electromechanical system sensors, among which differential pressure pressure sensor has been widely concerned due to its advantages of large output signal, simple follow-up processing, and suitable for mass production. [0003] In order to ensure the sensitivity of the differential pressure sensor, the pressure-sensitive film is usually made very thin, especially for the differential pressure sensor. In this way, on the one hand, the linearity of the differential pressure sensor is reduced, and on the other hand, the reliability of the differential pressure sensor is also reduced. Contents of the invention [0004] In view of this, the present invention is committed to provi...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L1/18G01L9/06
CPCG01L1/18G01L9/06
Inventor 李刚胡维吕萍
Owner MEMSENSING MICROSYST SUZHOU CHINA