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Buffer pad for hot pressing of printed circuit board and preparation method

A technology of printed circuit boards and cushioning pads, which is applied in the fields of printed circuit manufacturing, laminated printed circuit boards, printed circuits, etc. It can solve problems such as easy drop, embrittlement of product quality, and impact on product quality, so as to avoid risks and improve product quality. Quality, the effect of quality assurance

Active Publication Date: 2018-11-06
昆山市柳鑫电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the deficiencies in the prior art above, the purpose of the present invention is to provide a cushion pad for hot pressing of printed circuit boards and a preparation method thereof, aiming to solve the problem that the existing kraft paper will be embrittled and the paper scraps will cause the product quality to decline, and the existing fiber Cushion pads are easy to drop fibers and directly affect product quality

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] The preparation method of the printed circuit board hot-pressing buffer pad described in the present embodiment comprises the following steps:

[0035] a. At a temperature of 145°C and a vehicle speed of 15m / min, aramid 1313 paper containing a phenolic resin modified epoxy resin adhesive was prepared, with a glue content of 20%, a fluidity of 7%, and a volatility of 7%;

[0036] b. First, laminate a piece of aramid 1313 paper containing phenolic resin modified epoxy resin adhesive with aramid 1414 felt, then wrap it on five sides, wrap the last side around the four sides of 5mm, and finally wrap the other piece Aramid 1313 paper containing phenolic resin modified epoxy resin adhesive is attached to the last exposed surface so that the aramid 1414 felt is covered with aramid paper prepreg containing phenolic resin modified epoxy resin adhesive. 1313 paper fully wrapped;

[0037] c. Under the conditions of temperature 180°C, vehicle speed 20m / min, and pressure 6Mpa, pres...

Embodiment 2

[0039] The preparation method of the printed circuit board hot-pressing buffer pad described in the present embodiment comprises the following steps:

[0040]a. At a temperature of 160°C and a vehicle speed of 15m / min, aramid 1313 paper containing PTFE was prepared, with a glue content of 40%, a fluidity of 7%, and a volatility of 7%;

[0041] b. First, laminate a piece of aramid 1313 paper containing PTFE with aramid 1414 felt, then wrap it on five sides, and wrap the four sides of 5mm on the last side, and finally attach another piece of aramid 1313 paper containing PTFE On the last exposed side, so that the aramid 1414 felt is completely wrapped by the aramid 1313 paper containing PTFE;

[0042] c. Under the conditions of temperature 200°C, vehicle speed 20m / min, and pressure 6Mpa, press rollers to make a high-temperature and high-pressure-resistant fiber felt wrapped with aramid 1313 paper on six sides.

Embodiment 3

[0044] The preparation method of the printed circuit board hot-pressing buffer pad described in the present embodiment comprises the following steps:

[0045] a. At a temperature of 145°C and a vehicle speed of 15m / min, aramid 1414 paper containing a phenolic resin modified epoxy resin adhesive was prepared, with a gluing amount of 20%, a fluidity of 7%, and a volatility of 7%;

[0046] b. First, a piece of aramid 1414 paper containing phenolic resin modified epoxy resin adhesive is laminated with polybenzoxazole fiber felt, and then wrapped on five sides, and the last side is wrapped on four sides of 5mm, and finally wrapped Another piece of aramid 1414 paper containing phenolic resin modified epoxy resin adhesive is attached to the last exposed surface, so that the polybenzoxazole fiber felt is covered with phenolic resin modified epoxy resin adhesive. Lun 1414 fully wrapped;

[0047] c. Under the conditions of temperature 180°C, vehicle speed 20m / min, and pressure 6Mpa, pr...

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Abstract

The invention discloses a buffer pad for hot pressing of a printed circuit board and a preparation method thereof. The buffer pad for hot pressing of the printed circuit board comprises a high-temperature-resistant high-pressure fiber felt, a high-temperature-resistant high-pressure fiber layer and a high-temperature-resistant adhesive, wherein the high-temperature-resistant high-pressure fiber felt is a hexahedron; the six faces of the high temperature and high pressure resistant fiber felt are wrapped by the high temperature and high pressure resistant fiber layer through the high temperature resistant adhesive. As the six sides of the high-temperature-resistant high-pressure fiber felt of the invention are wrapped by high temperature and high pressure resistant fiber cloth / paper, the fiber drop can be effectively reduced when the high temperature and high pressure resistant fiber cloth / paper is used as a cushion, the PCB product quality is improved, and the product defect risk is greatly reduced. In addition, the cushion has a significant increase in cushioning pressure and cushioning temperature. In addition, since the cushion is fully wrapped on all six sides, there is not much lateral and longitudinal shrinkage deformation during the pressing process or after the pressure is removed. The invention is environmentally friendly and economical, and is convenient for PCB manufacturer to automated production.

Description

technical field [0001] The invention relates to the technical field of a buffer pad for hot pressing of printed circuit boards, in particular to a buffer pad for hot pressing of printed circuit boards and a preparation method thereof. Background technique [0002] The traditional lamination process has been used in the manufacturing process of printed circuit boards. Copper foil and semi-cured are laminated into a sheet and placed between two steel plates. The steel plate plays the role of isolating the sheet. The outermost steel plate and the bottom plate are isolated by materials with a buffering effect. Then push the prepared material into the hot press for heating and pressing to make the board solidify and form. The cushioning material used in the early days was kraft paper, which has a certain heat and pressure resistance, and is generally used in a stacked manner. However, kraft paper should not be used too many times. Usually kraft paper is used as a cushion by com...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0058H05K2203/068
Inventor 杜山山罗小阳张伦强张德库
Owner 昆山市柳鑫电子有限公司
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