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A kind of buffer pad for hot pressing of printed circuit board and preparation method thereof

A technology of printed circuit boards and buffer pads, which is applied in the fields of printed circuit manufacturing, laminated printed circuit boards, printed circuits, etc., can solve the problems of embrittled product quality, easy drop, drop, etc., to ensure quality, improve quality, The effect of risk avoidance

Active Publication Date: 2021-04-09
昆山市柳鑫电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the deficiencies in the prior art above, the purpose of the present invention is to provide a cushion pad for hot pressing of printed circuit boards and a preparation method thereof, aiming to solve the problem that the existing kraft paper will be embrittled and the paper scraps will cause the product quality to decline, and the existing fiber Cushion pads are easy to drop fibers and directly affect product quality

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034]The preparation method of the hot pressing buffer of the printed circuit board described in this embodiment includes the following steps:

[0035]a. Under the temperature of 145 ° C, the vehicle speed is 15 m / min, the aramid 1313 paper containing a phenolic resin modified epoxy resin adhesive, a gum containing 20%, a flow rate of 7%, and a volatility of 7%;

[0036]b. First, a aramid 1313 paper containing a phenolic resin-modified epoxy resin adhesive is combined with aramid 1414 felt, then perform five-sided package, the last side wraps 5mm four sides, and finally one piece Aravulatory 1313 paper containing phenolic resin modified epoxy resin adhesive is attached to the last naked surface, so that aramid 1414 felt is a aramid paper semi-solidified tablet containing a phenolic resin modified epoxy resin adhesive 1313 paper complete package;

[0037]c. High-temperature high-pressure fiber felts of six-s-s-sided wrapped aramid 1313 paper by extrusion rolls at a temperature of 180 ° C, ...

Embodiment 2

[0039]The preparation method of the hot pressing buffer of the printed circuit board described in this embodiment includes the following steps:

[0040]a. Under the temperature of 160 ° C, the vehicle speed is 15 m / min, the aramnium 1313 paper containing PTFE, the gum is 40%, the flow rate is 7%, and the volatility is 7%;

[0041]b. First, a 113 paper containing PTFE is laminated with aramid 1414 felt, and then perform five wraps, the last side wraps 5mm four sides, and finally puts another aramid 1313 paper containing PTFE. In the last naked show, such a aramid 1414 felt is fully packaged by aramid 1313 paper containing PTFE;

[0042]c. High-temperature high-pressure fiber felts of six-sided wrapped aramid 1313 paper by extrusion rolls at a temperature of 200 ° C, a vehicle speed 20 m / min, pressure 6 MPa.

Embodiment 3

[0044]The preparation method of the hot pressing buffer of the printed circuit board described in this embodiment includes the following steps:

[0045]a. Under the temperature of 145 ° C, the vehicle speed is 15 m / min, the aramid 1414 paper containing a novolak resin modified epoxy resin adhesive, 20%, and 7% flow rate, volatility of 7%;

[0046]b. First, a aramid 1414 paper containing a phenolic resin modified epoxy resin adhesive is laminated together, and then the five-sided package, the last side wraps 5mm four sides, finally Another aramid 1414 paper containing a phenolic resin modified epoxy resin adhesive is attached to the last naked show, such that polybenzoxazole fiber felt is contained in a phenolic resin modified epoxy resin adhesive Full package 1414;

[0047]c. High-temperature high-pressure fiber felts of six-sided wrapped aramid 1414 paper by extrusion rolls at a temperature of 180 ° C, a vehicle speed of 20 m / min, and a pressure-resistant high-pressure fiber felt.

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Abstract

The invention discloses a buffer pad for hot pressing of printed circuit boards and a preparation method thereof. The printed circuit board hot-pressing buffer pad includes: high temperature and high pressure resistant fiber felt, high temperature and high pressure resistant fiber layer and high temperature resistant adhesive, the high temperature and high pressure resistant fiber felt is a hexahedron; the six high temperature and high pressure resistant fiber felt The surface is wrapped by the high temperature and high pressure resistant fiber layer through the high temperature resistant adhesive. The high temperature and high pressure resistant fiber felt of the present invention is wrapped with high temperature and high pressure resistant fiber cloth / paper on six sides, which can effectively reduce fiber drop when used as a cushion, improve the quality of PCB products, and greatly reduce the risk of product defects. In addition, the cushion pad has a great improvement in cushioning pressure and cushioning temperature. In addition, since the cushion pad is wrapped on all six sides, there is no large shrinkage deformation in the horizontal and vertical directions during the pressing process or after the pressure is removed. The invention is environmentally friendly and economical, and is convenient for automatic production of PCB manufacturers.

Description

Technical field[0001]The present invention relates to the field of thermal pressing cushioning cushions of printed circuit boards, and more particularly to a thermocompression buffer cushion for a printed circuit board and a preparation method thereof.Background technique[0002]A conventional lamination process is used in the printing circuit board manufacturing process, copper foil and semi-organized stacks, placed between two steel sheets, and the steel sheets are isolated from the sheet. The outermost steel sheet and the bottom plate are isolated with a buffered material. The mixed material is then pushed into the hot press to heat and pressurize, so that the sheet is solidified. Early use of buffered materials are kraft paper, kraft paper has a certain heat resistance resistance, generally used in a plurality of stacks. However, the number of teppights can not be too much, usually the kraft paper is used as a cushion by using multiple new and old combinations. After using a high-...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0058H05K2203/068
Inventor 杜山山罗小阳张伦强张德库
Owner 昆山市柳鑫电子有限公司
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