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Flexible electronic device module, article and bonding method for manufacturing same

An electronic device, bending technology, applied in the field of bendable electronic device modules, their bending, products, which can solve the problems of cohesive and/or delamination failure, increased bending force, etc.

Active Publication Date: 2021-08-13
CORNING INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As such, these covering elements can be prone to cohesive and / or delamination failure modes within the module
In addition, these complex interactions lead to increased bending forces required by the consumer to bend and fold the cover element

Method used

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  • Flexible electronic device module, article and bonding method for manufacturing same
  • Flexible electronic device module, article and bonding method for manufacturing same
  • Flexible electronic device module, article and bonding method for manufacturing same

Examples

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Embodiment Construction

[0038] Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts. Ranges can be expressed herein as from "about" one particular value, and / or to "about" another particular value. When such a range is expressed, another embodiment includes from the one particular value and / or to the other particular value. Similarly, when values ​​are expressed as approximations, by use of the prefix "about," it will be understood that the particular value forms another embodiment. It should also be understood that the endpoints of each range are meaningful in relation to and independent of the other endpoint.

[0039] Among other features and benefits, the foldable electronics modules and articles of the present disclosure (and their methods of manufacture) provide mechanical reliability at small bend radii (e.g., und...

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Abstract

The foldable electronics module includes a glass cover element having a thickness of about 25-200um, a modulus of elasticity of about 20-140GPa. The module further comprises: a stack having a thickness of about 50-600 um; and a first adhesive for engaging the stack with the second major surface of the covering element, the first adhesive having a shear modulus of about 0.01 MPa to about 1 GPa and The glass transition temperature is at least 80°C. In addition, the device module includes a bend bond residual stress region through the thickness of the cover element within the central region of the cover element in the range of the maximum compressive residual from the second major surface along the central bending axis of the cover element. Stress to the maximum tensile residual stress at the first major surface.

Description

[0001] Cross References to Related Applications [0002] This application claims priority under 35 U.S.C. §119 to U.S. Provisional Application Serial No. 62 / 309624, filed March 17, 2016, which application is based upon and is hereby incorporated by reference in its entirety. technical field [0003] The present disclosure generally relates to bendable electronics modules, articles, and bending methods for making them. More specifically, the present disclosure relates to bendable electronics modules having glass-containing covers for foldable display device applications, and bending methods for making them. Background technique [0004] Flexible versions of products and components that are often inherently rigid are being conceived for new applications. For example, flexible electronics can offer thin, lightweight, and flexible properties, which offer opportunities for new applications including curved displays and wearable devices. Many of these flexible electronic devices...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/1333
CPCB32B17/06C03C3/085C03C3/091C03C17/28G06F1/1652H04M1/0268C03C3/093H04M1/0216C09K2323/05C09K2323/06
Inventor 胡广立D·乔希E·帕克Y·K·卡洛士
Owner CORNING INC
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