Fine high-efficiency etching technology in high-order high-density circuit board

Abstract

The invention discloses a fine high-efficiency etching technology in a high-order high-density circuit board. The technology has the following steps that S1) copper plates are welded to the top and bottom of a substrate respectively, adhesive tapes are pasted to the top of the upper copper plate and the bottom of the lower copper plate respectively, the shapes of the adhesive tapes are kept consistent with that of a required line layer, sealing strips are pasted to positions where the adhesive tapes make contact with the substrate, an etching solution is avoided from corroding copper materialsunder the adhesive tapes, and accurate etching is achieved; and S2) an etching machine is prepared by that a rotating shaft is installed at the two sides of an etching groove rotationally, one end ofthe rotating shaft is provided with a handwheel, a bearing table is welded to the rotating shaft, two blind holes are formed in the top of the bearing table, extension springs are welded into the blind holes respectively, a pressure plate is welded to the top of each spring, and an outlet duct is connected to a gas outlet of an air compressor. Thus, the etching cost can be reduced, inorganic acidcan be used in a cyclic way, and operation is simple.

Description

technical field [0001] The invention relates to a fine and high-efficiency etching process on a high-order high-density circuit board. Background technique [0002] High-end high-density circuit boards are formed by alternately laminating and hot-pressing multiple substrates and adhesive material layers formed with circuits, and then using drilling and metallization processes in the holes to achieve the connection and conduction between the circuits of each layer Features. Among them, the circuit layer on the substrate is obtained by etching with an etching solution. Before etching, the parts that do not need to be etched are pasted with tape, and then the circuit board is placed in a tank filled with an etching solution for etching. The copper material covered by the tape, when the tape is removed, the required circuit layer can be obtained. However, when the workers salvage the circuit board from the tank, the etching solution is attached to the surface of the circuit bo...

AI Technical Summary

Problems solved by technology

However, when the workers salvage the circuit board from the tank, the etching solution is attached to the surface of the circuit board, and the etching solution is transported to the subsequent cleaning process along with the circuit board, causing the level of the etching solution in the tank to drop At this time, it is necessary to replenish new etching solution, resulting in an increase in cost