Composite aluminum substrate, production technology thereof, and LED circuit board

A production process and technology of composite aluminum, which is applied in the direction of circuit substrate materials, improvement of metal adhesion of insulating substrates, printed circuits, etc., can solve the problems of easy warping, increased cost, low efficiency, etc. Cost input, effect of reducing production cost

Active Publication Date: 2018-11-20
俊萱新材料(杭州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. It is easy to warp or even fall off when bonded at high temperature
[0006] 2. Because the insulating sheet is not magnetic, the process of using the suction cup will greatly increase the cost invested in the production process
[0007] 3. The efficiency of the whole process is still low

Method used

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  • Composite aluminum substrate, production technology thereof, and LED circuit board
  • Composite aluminum substrate, production technology thereof, and LED circuit board
  • Composite aluminum substrate, production technology thereof, and LED circuit board

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Embodiment Construction

[0153] The following are specific embodiments of the invention and in conjunction with the accompanying drawings, the technical solutions of the present invention are further described, but the present invention is not limited to these embodiments.

[0154] Such as Figure 1-3 as shown,

[0155] The production process of the composite aluminum substrate includes the following production steps:

[0156] A, punching, punch out some through holes 11 through the thickness direction of the aluminum plate on the aluminum plate 1;

[0157] B, grind the plate, fix the aluminum plate in the A step horizontally, process some strip grooves 12 on the upper surface of the aluminum plate by the grinding groove processing device;

[0158] C, cleaning, adopt alkaline water to clean the aluminum plate in the B step;

[0159] H, film coating, the green film 6 is covered on the side of the aluminum plate after step C away from the strip groove.

[0160] D, inlaying, the aluminum plate 1 is f...

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Abstract

The invention belongs to the technical field of circuit boards, and particularly relates to a production technology of a composite aluminum substrate, and an LED circuit board. The problems of unreasonable design and the like in the prior art are solved. The production technology of the composite aluminum substrate comprises the following production steps of A, punching, B, plate grinding, C, cleaning, D, inlaying, E, sheet cladding, and F fixing. The production technology of the composite aluminum substrate has the advantages that the bonding strength can be improved, the cost can be reduced,and the production efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of circuit boards, and in particular relates to a production process of a composite aluminum substrate and an LED circuit board. Background technique [0002] In the field of LED lighting lamps, an aluminum-based composite board is generally used as a substrate, and then a driving circuit and an LED illuminant connected to the driving circuit are arranged on the substrate. [0003] The existing aluminum-based composite board generally uses glue or semi-dry glue to connect the two layers, and at the same time, the insulating sheet on the aluminum board is pressed into the assembly from top to bottom using a suction cup. [0004] Although the above-mentioned technology can meet the production requirements to a certain extent, it also has the following defects at least in the above-mentioned technology: [0005] 1. High temperature bonding is prone to warping or even falling off. [0006] 2. Because the insul...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/02H05K3/44H05K3/38H05K1/05
Inventor 李亚涛
Owner 俊萱新材料(杭州)有限公司
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