Film attachment method and system

A film and film technology, applied in household components, household appliances, other household appliances, etc., can solve problems such as poor lamination accuracy, and achieve the effect of reducing indentation or damage, and reducing the generation of air bubbles

Inactive Publication Date: 2018-11-23
三得应用材料(深圳)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the above-mentioned prior art, the first purpose of the present invention is

Method used

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  • Film attachment method and system
  • Film attachment method and system

Examples

Experimental program
Comparison scheme
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Example Embodiment

[0040] The present invention will be further described in detail below in conjunction with the drawings.

[0041] A filming method and filming system, such as figure 1 As shown, including the following steps:

[0042] Paste film, paste protective film on the upper and lower surfaces of the film material. In this embodiment, opposing pressing rollers are used to press the film material and the protective film. The pressing roller can make the film material and the protective film more tightly attached, and discharge air bubbles, so that the protective film can protect the film material and reduce impurities on the film. The impact caused by the surface of the material.

[0043] Cutting is to cut the film to make the shape of the film consistent with the substrate. In this embodiment, a laser laser engraving machine is used. The designed drawing data is input into the laser laser engraving machine, and the film material is placed on the operating table. The operating table has severa...

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PUM

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Abstract

The invention discloses a film attachment method and system. The film attachment method comprises the steps of conducting locating and attachment on a substrate and a film material, so that an attachment combined body is obtained; conducting predetermined-position heating on the attachment combined body at the side, opposite to the substrate, of the film material, so that the attachment combined body is bonded at a predetermined position; and aligning the substrate with the film material, then, attaching the film material to the substrate, and locally heating the film material. Due to the factthat an attachment face of the film material is provided with a hot melting adhesive film, adhesive is generated after the attachment face is heated, and thus, the film material can be bonded to thesubstrate at the heated position; and the film material can be preliminarily fixed to the substrate conveniently. Compared with the existing mode that a film material is extruded and fixed to a substrate in all directions, air bubbles generated between the film material and the substrate are reduced; meanwhile, the problem that the pressing marks are generated or the film material is damaged in the mechanical extruding process is reduced; positional information of the film material and positional information of the substrate are collected separately, so that locating precision is high, and thelocation dimension is highly unified and stable; and product quality is guaranteed, and the production cost is lowered.

Description

technical field [0001] The invention relates to the technical field of film sticking of electronic products, and more specifically, it relates to a film sticking method and a film sticking system. Background technique [0002] With the rapid development of the information age, electronic display screen films can be seen everywhere in life, especially the emergence of touch screens for electronic products such as computer screens, tablet computers, and mobile phones. It is necessary to protect the screen without affecting the display effect and touch screen. effect products. In the touch screen manufacturing process, it is often necessary to attach the film material to the glass surface of the touch screen. For the purpose of firm combination, the lamination process occupies an important position in the current various molding process methods. [0003] However, during the bonding process, the positioning between the base material and the film material is unstable, which mak...

Claims

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Application Information

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IPC IPC(8): B29C63/02B29L31/34B29L11/00
CPCB29C63/0004B29C63/0056B29C63/0065B29C63/02B29L2011/0066B29L2031/3425B29L2031/3437B29L2031/3475
Inventor 邵文锋成小强
Owner 三得应用材料(深圳)有限公司
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