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High-speed optical transmitter with a silicon substrate

A technology for optical transmitters and substrates, applied in optics, light guides, lasers, etc.

Inactive Publication Date: 2018-11-23
SKORPIOS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Silicon, on the other hand, is not a direct bandgap material

Method used

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  • High-speed optical transmitter with a silicon substrate
  • High-speed optical transmitter with a silicon substrate
  • High-speed optical transmitter with a silicon substrate

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Embodiment approach 1

[0027]Embodiments generally relate to optical transmitters with silicon platforms. In some embodiments, the optical transmitter provides a 400Gb / s transmission rate. The chip is bonded to the platform. In some embodiments, the chip is made of III-V material and the platform is a silicon-on-insulator (SOI) wafer. In some embodiments, a combination is used as described in US Application No. 14 / 509,914, filed October 8, 2014, which is incorporated herein by reference. In some embodiments, a chip is incorporated into a recess of the platform. In some embodiments, the chips are formed from epitaxial layers of compound semiconductor materials (eg, III-V materials). In some implementations, chips are used to perform functions that are difficult for silicon to perform (e.g., a chip with a direct bandgap is used as a gain medium or a modulator for a laser; silicon has an indirect bandgap, making silicon a poor optical transmitter ). An example of a tunable laser using a chip for t...

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Abstract

A 400 Gb / s transmitter is integrated on a silicon substrate. The transmitter uses four gain chips, sixteen lasers, four modulators to modulate the sixteen lasers at 25 Gb / s, and four multiplexers to produce four optical outputs. Each optical output can transmit at 100 Gb / s to produce a 400 Gb / s transmitter. Other variations are also described.

Description

technical field [0001] This application claims U.S. Provisional Application No. 62 / 292,633, filed February 8, 2016, entitled "High-Speed ​​Optical Transmitters With Silicon Substrates," U.S. Provisional Application No. 62 / 292,675, filed February 8, 2016, entitled "Broadband Rearview Mirrors for III-V Chips in Silicon Photonics," U.S. Provisional Application No. 62 / 292,636, the disclosure of which is incorporated herein by reference for all purposes. [0002] The following three U.S. patent applications were filed concurrently, and the entire disclosures of these applications are incorporated by reference into this application for all purposes: [0003] Application 15 / 426,823, entitled "High-Speed ​​Optical Transmitters With Silicon Substrates," filed February 7, 2017; [0004] Application 15 / 426,366, filed February 7, 2017, entitled "Stepper Optical Bridge for Connecting Semiconductor Waveguides"; and [0005] Application 15 / 426,375, entitled "Broadband Rearview Mirrors for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/42G02B6/12
CPCH01S5/021G02B6/42G02B6/12H01S5/4037H01S5/141H01S5/4062H01S5/0287H01S5/026H01S5/02326H04J14/0305H01S5/0202H01S5/028H01S5/22H01S5/3013H01S5/343H01S5/4025H01S5/4087H04B10/505H04J14/02G02B6/12002G02B6/12004G02B6/12007G02B6/122G02B6/136G02B2006/12061G02B2006/12104G02B2006/12121G02B2006/12142G02B2006/12147
Inventor 李国良斯蒂芬·B·克拉苏利克S·德赛
Owner SKORPIOS TECH