Boring-milling machining method of high-precision semicircular hole group

A technology for boring and milling processing and semi-circular holes, which is applied in the field of boring and milling processing of high-precision semi-circular hole groups, can solve problems such as low survival rate of parts, achieve reasonable and stable contact stress, optimize rough and finish machining allowance, and improve product quality. Effect

Active Publication Date: 2018-12-07
XIAN FLIGHT SELF CONTROL INST OF AVIC
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Problems solved by technology

[0003] The technical problem solved by the invention: In order to meet the processing requirements of high-precision semicircular hole groups in aviation electromechanical products, reduce the influence of chip breaking and cutting deformation caused by semicircular structures, improve product quality, shorten production cycle, and reduce production costs, solve the traditional processing method In order to solve the problem of low survival rate of lower parts, the present invention proposes a boring and milling method suitable for high-precision semicircular hole groups, so as to realize the boring and milling processing of such high-precision semicircular hole groups

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  • Boring-milling machining method of high-precision semicircular hole group

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Embodiment 1

[0031] The material of an output shaft part is 15-5PH stainless steel, and the diameter of the semicircular hole group is mm, the diameter dimension of the central hole intersecting it is Machining on a three-axis CNC machine, combined with attached figure 1 The specific processing process is as follows:

[0032] 1) Reasonably arrange the rough and finish machining processes. The rough, semi-finish and finishing processes in the whole process are drilling, milling, boring and reaming in sequence. Heat treatment stress relief processes are added between the drilling and milling processes and between the milling and boring processes.

[0033] 2) Optimize roughing and finishing allowance. Rough drilling bottom hole is Φ5mm, semi-finishing milling bottom hole to Φ5.9mm, semi-finishing boring bottom hole to Φ5.96mm, finishing reaming group to final size

[0034] 3) The setting of CNC machining cutting parameters. Combined with the cutting performance of 15-5PH stainless ste...

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Abstract

The invention belongs to the field of machining and discloses a boring-milling machining method of a high-precision semicircular hole group. To meet machining requirements of the high-precision semicircular hole group in an aviation electromechanical product, reduce chip breaking cutting deformation caused by semicircular structures, improve the machining quality, reduce unnecessary rework, repairand rejection, solve the problem of a low part survive rate under a traditional machining method condition, machining of the high-precision semicircular hole group is achieved through the method comprising the following steps that (1) rough machining and finish machining procedures are reasonably arranged; (2) the rough machining allowance and the finish machining allowance are optimized; and (3)cutting machining parameters are set. Through machining according to the method, boring-milling machining of the high-precision semicircular hole group can be achieved, the product quality is improved, the production cycle is shortened, and the product cost is lowered.

Description

technical field [0001] The invention belongs to the field of mechanical processing, and relates to a boring and milling processing method of a high-precision semicircular hole group. Background technique [0002] The high-precision semi-circular hole group structure is common in aviation mechanical and electrical products. Due to the limitation of this type of structure, chip-breaking cutting method is required in actual processing, and the force is uneven during the cutting process of the tool. At present, the traditional processing method is roughing, drilling, bottom hole, boring or reaming and finishing hole group to size. Or the dimensional accuracy is out of tolerance, the survival rate of parts is low, and it is difficult to guarantee the matching delivery node of the product, which has become a major problem restricting the quality of this type of product. SUMMARY OF THE INVENTION [0003] The technical problem solved by the present invention: in order to meet the...

Claims

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Application Information

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IPC IPC(8): B23P15/00
CPCB23P15/00
Inventor 耿卫庭许迎飞成武冬郭晓炜潘静李梦
Owner XIAN FLIGHT SELF CONTROL INST OF AVIC
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