Test pin module and test contact formed by test pin modules

A test pin and contact piece technology, applied in the direction of measuring leads/probes, etc., can solve problems such as contact failure between test pins and product pins, and achieve the effect of increasing the effective contact area, reducing contact failure, and having a simple structure

Pending Publication Date: 2018-12-07
四川峰哲精密设备有限公司
View PDF6 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] One of the purposes of the present invention is to provide a test pin assembly to solve the problem of contact failure between test pins and product pins when testing semiconductor products.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Test pin module and test contact formed by test pin modules
  • Test pin module and test contact formed by test pin modules

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Such as figure 1 As shown, a test needle assembly includes at least two test needle groups arranged side by side, the test needle group includes a first test needle body 1 and a second test needle body 2, and the second test needle body 2 is arranged on Above the first test pin body 1. The first test needle body 1 is provided with a first test needle 3 , and the second test needle body 2 is provided with a second test needle 4 on the right side of the first test needle 3 . At the same time, the first test needle 3 is provided with a first test needle contact surface 6 for contacting with product pins, and similarly, the second test needle 4 is provided with a second test needle contact surface 7 . The test pin assembly of the present invention is used for contacting and testing product pins, and the test pin assembly includes at least two sets of test pins, and each test pin set includes two surfaces that are in contact with product pins, then When the new type is use...

Embodiment 2

[0025] Such as figure 2 As shown, the test contact sheet of the present invention includes a test contact sheet substrate 8 on which at least one test pin assembly as described in Embodiment 1 is provided. The test pin assembly is fixed on the test contact sheet substrate 8, and an insulating medium is filled between the first test pin body 1 and the second test pin body 2, so as to ensure that the first test pin body 1 and the second test pin body 2 insulated.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention discloses a test pin module. The test pin module comprises at least two sets of test pins arranged side by side, the test pin module comprises a first test pin main body (1) anda second test pin main body (2) arranged at the upper portion of the first test pin main body (1); the first test pin main body (1) is provided with a first test pin head (3), the second test pin mainbody (2) is provided with a second test pin head (4) located at the right side of the first test pin head (3), and the first test pin main body (1) and the second test pin main body (2) are providedwith test board contact surfaces (5). The test pin module and the test contact formed by test pin modules are simple in structure and low in cost, the two test pin heads of the test pin sets are in contact with the product pins for test, the test pin module at least comprises two sets of the test pins arranged side by side, at least four test pin heads are in contact with the product pins when test so as to greatly reduce the problem of the failed contact of the test pin module and the product pins so as to improve the accuracy of the product test result and improve the product percent of pass, and therefore, the test pin module and the test contact formed by test pin modules are suitable for promotion and usage.

Description

technical field [0001] The invention relates to a mechanical structure used for testing semiconductor products, in particular to a test contact sheet composed of the same. Background technique [0002] Before the semiconductor product manufacturing process is completed, it needs to enter the final test stage. The final test is to use the matching between the test machine (Tester), sorter (Handler), test board (DUT Board) and test contact piece (Test Finger) Combination to test each product, the test line of the tester is connected to the line on the test board, the line on the test board is connected to one end of the test pin of the test contact piece, and the other end of the test pin is directly connected to the pin of the semiconductor product Contact, and then test the product. During the manufacturing process, burrs are easily generated on the contact surface of the pin and the test pin, and at the same time, the contact surface of the pin is also easy to generate irr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/06
CPCG01R1/06
Inventor 周峰
Owner 四川峰哲精密设备有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap