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RC passive equalizer structure for shielded differential through-silicon via and design method thereof

A technology of through-silicon vias and equalizers, applied in the field of passive equalizer structures, can solve the problems of no passive equalizers, achieve low power consumption, and improve transmission quality

Active Publication Date: 2018-12-07
HANGZHOU DIANZI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there is no special passive equalizer for the intersymbol interference problem in shielded differential TSV transmission in high-speed digital signal transmission systems.

Method used

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  • RC passive equalizer structure for shielded differential through-silicon via and design method thereof
  • RC passive equalizer structure for shielded differential through-silicon via and design method thereof
  • RC passive equalizer structure for shielded differential through-silicon via and design method thereof

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Embodiment Construction

[0038] The present invention will be further described below with reference to the accompanying drawings.

[0039] Figure 1A-B is a top view and a center cross-sectional view of the shielded differential TSV 100 structure disclosed in Chinese Patent No. 105810663A. The shielded differential TSV 100 is located in a silicon substrate, and includes an inner differential TSV pair and a shielding shell in sequence from the inside to the outside. The internal differential through-silicon via pair is composed of two columnar through-silicon vias with the same structure, and is used for the transmission of differential signals between layers in the three-dimensional integrated circuit. The columnar TSV is composed of a metal inner core 101 and an outer ring oxide layer 102, wherein the metal inner core 101 is used to transmit current, and the outer ring oxide layer 102 is used to isolate DC leakage. The shielding shell is composed of an inner oxide layer 103 , a ring-shaped metal in...

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Abstract

The invention discloses an RC passive equalizer structure for a shielded differential through-silicon via and a design method thereof and is designed through utilizing the idea of a resistor-capacitorresonant circuit. An inter-symbol crosstalk problem existing in a digital differential signal transmission system can be solved, a transmission frequency band is made to become flat, and thereby transmission quality of a high speed digital signal is effectively improved. The method is advantaged in that device parameters of the RC passive equalizer required by the special differential transmission system can be accurately calculated, and the quality of the differential transmission signal is made to be optimal.

Description

technical field [0001] The invention belongs to the technical field of passive electronic devices, and relates to a passive equalizer structure and a design method for differential signal transmission. Background technique [0002] Differential transmission has become an important technology in high-speed digital signal transmission systems. Differential transmission has a more efficient ability to suppress external interference, which can effectively improve the transmission quality of the signal. In three-dimensional integrated circuits, the differential transmission structure for through-silicon via technology can effectively improve system integration, reduce energy loss, and improve system stability. In this regard, the researchers proposed a ground-signal-signal-ground (G-S-S-G) differential through-silicon via transmission structure to improve the transmission quality of high-speed signals, but this structure cannot eliminate the difference between differential pairs...

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Application Information

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IPC IPC(8): H03H7/06G06F17/50H01L23/48
CPCH03H7/06H01L23/481G06F30/367
Inventor 赵文生傅楷胡月王高峰
Owner HANGZHOU DIANZI UNIV