A splitting process for laser optical glass cutting

A technology for optical glass and slitting, which is applied in glass cutting devices, glass manufacturing equipment, laser welding equipment, etc., which can solve the problems of large force and inability to separate and remove the wafer from the waste frame, so as to reduce equipment costs and improve slitting efficiency , The effect of reducing the cost of process use

Active Publication Date: 2020-08-14
杭州千皓科技有限公司
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

However, a problem existing in laser cutting processing at present is that after laser cutting large-sized optical glass into several small-sized optical glasses, since the slit between the small-sized glass plate and the optical glass plate after laser cutting is only five Micron or so, the force between the sheets is relatively large, they will not fall off freely, and a certain external force is required to separate the sheets
In the prior art, for the processing of square sheets, the process of expanding the bottom plastic film is usually used to separate the processed glass sheets and take out the finished products. The membrane process separates the wafer from the waste frame and takes it out

Method used

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  • A splitting process for laser optical glass cutting
  • A splitting process for laser optical glass cutting

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0024] see Figure 1-2 , the present invention provides a technical solution: a splitting process of laser optical glass cutting, comprising the following steps:

[0025] The first step: laser cutting: the optical glass plate 1 is placed in a laser cutting machine for cutting, and the shape of the finished glass plate 2 is cut out, and the shape of the finished glass plate 2 can be any size and shape;

[0026] Step 2: Install the net: put the optical glass pl...

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Abstract

The invention discloses a fracturing process for laser optical glass cutting. The process comprises the following steps: (1) an optical glass plate is placed in a laser cutting machine for cutting; (2) the optical glass plate is positioned in a fixture lifting basket after laser cutting; (3) the fixture lifting basket with the optical glass plate is totally merged in wetting permeation liquid by 10-30 seconds; (4) the merged fixture lifting basket with the optical glass plate is slowly pulled out from the wetting permeation liquid; and clean air currents are used for blow drying of the wettingpermeation liquid on the optical glass plate and the fixture lifting basket; (5) the dried optical glass plate is put in a plastic packing box; (6) the plastic packing box with the optical glass plate is transferred into a microwave working station for microwave processing; and (7) a finished glass plate and edge frame wastes in the plastic packing box are taken out. The process realizes automatic large-batch fracturing of wafers, improves the fracturing efficiency, reduces the use cost, guarantees the cleanness after fracturing, and reduces the cost of similar process laser fracturing equipment.

Description

technical field [0001] The application technical field of laser cutting of optical glass of the present invention is specifically a splitting process of laser optical glass cutting. Background technique [0002] In the current microelectronics industry, optical applications are becoming more and more extensive. The precision and efficiency of optical glass manufacturing and processing are constantly improving. Generally, the optical glass manufacturing process in the microelectronics industry is as follows: 1. Coating optical films with specific optical properties on the substrate through a coating machine, such as anti-reflection film, anti-reflection film, infrared filter film, etc. 2. Process the coated glass into the shape, specification and size required for assembly. Now optical glass forming processing mainly includes CNC machine tool processing, laser cutting processing, mechanical wire cutting or blade cutting process. For small size, circular or square optical f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03B33/04
CPCB23K26/38B23K26/402B23K26/70
Inventor 吕涛王豪
Owner 杭州千皓科技有限公司
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