2results about How to "Simplify subsequent processes" patented technology

The utility model relates to the technical field of batteries, and discloses a collector plate structure which comprises a shell assembly, a pole is arranged in the center of the top of the shell assembly, a collector plate is welded to the top of the inner side of the shell assembly, a middle protruding face is arranged in the center of the top face of the collector plate, and a middle thinning groove is formed in the top face of the middle protruding face. According to the utility model, after the through hole of the pole mentioned in the step 3 and the collector plate are assembled, a welding position is formed at the contact part, and then laser landing edge welding is carried out, so that a battery manufacturer can ensure high quality and high reliability of a battery assembly by adopting a laser landing edge welding technology; and meanwhile, the production efficiency is improved, the cost is reduced, laser welding becomes one of the preferred welding technologies in the battery manufacturing industry through the advantages, and the beneficial effects of improving the production efficiency and controlling the cost are achieved.

This invention relates to a phased array antenna subarray, comprising an external interface layer, a beamforming network layer, an amplitude and phase multifunction layer, a low-noise amplifier (LNOA) layer, and an antenna layer. The antenna layer and the LNOA layer are disposed on a first metal-based PCB board, while the amplitude and phase multifunction layer, the LNOA layer, and the antenna layer are disposed on a second metal-based PCB board. The bottom layer of the first metal-based PCB board and the top layer of the second metal-based PCB board are connected together, achieving integrated encapsulation of the external interface layer, beamforming network layer, amplitude and phase multifunction layer, LNOA layer, and antenna layer. Both the first and second metal-based PCB boards are provided with multiple grounding and heat-conducting vias. This invention enables the phased array antenna to be lightweight, small, and thin while also possessing excellent heat dissipation and good scalability, allowing for expansion of the number of elements and frequency bands.