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Integrated multi-parameter sensing chip, circuit board and electronic device

A technology of sensor chips and electronic devices, applied in circuits, electrical components, electrical solid devices, etc., to achieve the effects of high cost efficiency, compact overall structure, and simple test operation

Pending Publication Date: 2018-12-14
SHANGHAI ROCKSENSOR AUTOMATION +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The invention belongs to the chip-level integration route: three sensor chip modules of differential pressure, static pressure and temperature are integrated on the same chip at the same time, thereby effectively solving or alleviating the above problems and other problems existing in the prior art. one or more

Method used

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  • Integrated multi-parameter sensing chip, circuit board and electronic device
  • Integrated multi-parameter sensing chip, circuit board and electronic device
  • Integrated multi-parameter sensing chip, circuit board and electronic device

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Embodiment Construction

[0028] First of all, it should be noted that the structure, composition, characteristics and advantages of the multi-parameter sensor chip, circuit board and electronic device of the present invention will be specifically described below by way of example, but all descriptions are only for illustration , and they should not be construed as forming any limitation on the present invention.

[0029] In addition, for any single technical feature described or implied in the embodiments mentioned herein, or any single technical feature shown or hidden in the drawings, the present invention still allows and their equivalents) without any technical barriers, so it should also be considered that these more embodiments according to the present invention are within the scope of the description herein. In addition, for the sake of simplifying the drawings, the same or similar parts and features may only be marked at one or several places in the same drawing.

[0030] Please refer to Fi...

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Abstract

The invention relates to an integrated multi-parameter sensing chip, a circuit board and an electronic device. The multi-parameter sensing chip has a substrate (11) on which a top silicon layer (10) is provided, on which a differential pressure sensing chip module (3) for measuring differential pressure, an absolute pressure sensing chip module (6) for measuring absolute pressure, and at least twoof a temperature sensing chip modules (8) for measuring temperature are integrally fabricated. The multi-parameter sensing chip comprises a substrate (11). The adoption of the invention can make thewhole test operation simpler, more efficient and lower in cost, and is helpful in realizing more compact overall structure of the measuring device or system.

Description

technical field [0001] The invention relates to the field of chip technology, in particular to an integrated multi-parameter sensor chip, a circuit board and an electronic device. Background technique [0002] With the advancement of science and technology and social development, various electronic components, devices or equipment have been widely used. For example, people may need to use them to measure parameters such as pressure, temperature, and speed. However, there are still some defects and deficiencies in the prior art in this respect. [0003] For example, when measuring differential pressure in the process industry, there is often a certain static pressure at the same time. Since this static pressure will affect the accuracy of differential pressure measurement, it is necessary to detect the process static pressure in advance and perform static pressure compensation accordingly. For this reason, in the prior art, an additional static pressure sensor chip is usuall...

Claims

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Application Information

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IPC IPC(8): H01L25/065
CPCH01L25/0655
Inventor 王徐坚李卫民李俊毅姚康
Owner SHANGHAI ROCKSENSOR AUTOMATION