A communication chassis cabinet which is conducive to heat dissipation
A communication chassis and cabinet technology, applied in cooling/ventilation/heating renovation, electrical components, support structure installation, etc., can solve the problems of heat dissipation, easy to burn electronic components, etc., to achieve less environmental dependence, enhanced heat dissipation effect, enhanced The effect of ventilation
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Embodiment 1
[0037] Such as figure 1 , figure 2 As shown, a communication chassis cabinet that is conducive to heat dissipation includes a cabinet body 1 and a front cover 2 hinged with the cabinet body 1, and is characterized in that: the top surface of the cabinet body 1 is fixedly equipped with a water-cooling heat dissipation assembly 11, and the cabinet The rear wall of the body 1 is divided longitudinally into three areas with the same area on average, which are two circuit areas 18 and a hollow air exhaust area 13 in the middle of the two line areas 18. The air exhaust area 13 is provided with two The fixed shaft 19 on the ground is rotatably connected with some small fans 17 on the fixed shaft 19.
[0038] The working principle and process of this technical solution are as follows:
[0039] The present invention innovatively divides the rear wall of the cabinet body 1 into three areas, which are two circuit areas 18 and a hollow exhaust area 13 in the middle of the two line area...
Embodiment 2
[0042] According to Example 1, such as figure 1 , Figure 4 As shown, the water cooling heat dissipation assembly 11 includes a water tank 4 and a water cooling radiator 10, the water tank 4 is provided with a water tank inlet 5 and a water tank outlet 7, and the water cooling radiator 10 is provided with a water inlet 22 and a water outlet 23, The water tank inlet 5 and the water outlet 23 , and the water tank outlet 7 and the water inlet 22 are connected through the water pipe 12 , and the water-cooled radiator 10 is provided with a cold water coil 21 . The water-cooling heat dissipation assembly 11 is quiet, stable in cooling and less dependent on the environment. At the same time, the water-cooling radiator 10 is provided with a cold water coil 21, which can effectively enhance the heat dissipation effect.
Embodiment 3
[0044] According to embodiment 2, such as figure 1 As shown, the outer wall of the water tank 4 is pasted with a semiconductor cooling chip 6 . The semiconductor refrigeration sheet 6 can quickly cool down the water in the water tank 4, and then enters into the water-cooled radiator 10 again.
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