The invention relates to the technical field of
chip packaging, and provides a
chip packaging
welding method, which comprises the following steps of: putting a
chip workpiece and a jig into a preheating area, vacuumizing and then preheating;
infrared heating is started to a first
welding temperature after transferring into a
welding area, advancing is conducted at a first conveying speed, the vacuum degree and the temperature are monitored in real time, the vacuum degree is not lower than a threshold value, if vacuum continues to decrease and exceeds the threshold value or temperature fluctuation exceeds the threshold value,
infrared heating is suspended, and parameters are adjusted and speed is increased according to an actual pumping speed formula of the molecular pump; after welding, entering a cooling area, and maintaining the vacuum degree of 5 * 10 <-4 >-8 * 10 <-4 > Pa for cooling; and finally, closing a main pumping valve of the molecular pump, slowly opening an inflation valve, and inflating dry
nitrogen according to an inflation time formula until the pressure in the furnace is balanced with the
atmospheric pressure. And the process stability is good, the consistency of batch chip packaging quality can be ensured, and the welding spot defect is low.