Device for cooling electronic element by utilizing bionic alveolar heat exchanger

Abstract

The invention discloses a device for cooling an electronic element by utilizing a bionic alveolar heat exchanger. The device is used for heat exchange of the electronic element, and comprises the bionic alveolar heat exchanger and cooling equipment, wherein the bionic alveolar heat exchanger is fixed on the electronic element through a heat conduction fixing piece, is used for absorbing heat generated by the electronic element or a micro-electronic element, and is internally provided with a power core used for providing a refrigerant with flowing power, a loop heat pipe refrigerant channel used for circulation of the refrigerant, and a cavity; the cooling equipment is connected with the cavity through a micro-channel; the refrigerant is arranged in the micro-channel; and the refrigerant isused for transferring the heat to the cooling equipment for heat exchange so as to dissipate heat.

Description

technical field [0001] The invention belongs to the field of heat dissipation of electronics, microelectronics and corresponding equipment, and in particular relates to a device for heat dissipation of electronic components using a bionic alveolar heat exchanger. Background technique [0002] Electronic components consume a certain amount of electric energy when they are working, but most of the electric energy turns into heat. If no heat dissipation measures are taken, the temperature may reach or exceed the allowable working junction temperature of electronic components, and electronic components will be damaged due to high temperature. Electronic components in household appliances and industrial appliances need to work within a stable temperature range, therefore, heat sinks are widely used here, and more efficient heat dissipation devices or methods are particularly important. [0003] The most commonly used method at present is to install cooling devices for electronic ...

AI Technical Summary

Problems solved by technology

Commonly used are aluminum alloy and ceramic radiators. The technology of aluminum alloy radiators is mature but the process is complicated. The production process of ceramics is mainly sintering, the production cycle is too long, and it is relatively brittle.

The above two heat sinks, aluminum alloy heat sinks used in integrated circuits, may be coupled with other circuits to produce antenna effects and form electromagnetic interference, resulting in greater EMI problems

The ceramic heat sink is expensive and the cost is high

The structure of the original heat sink design of electronic components is relatively complicated, the installation is not convenient enough, and the heat dissipation effect is poor

In recent years, the heat dissipation method using heat pipe heat exchangers has gradually become popular, but the heat dissipation method of heat pipes is still inefficient and cannot meet the needs of more efficient heat exchange

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