Laser packaging device and packaging method

A technology of laser encapsulation and encapsulation method, which is applied to laser welding equipment, manufacturing tools, electrical solid devices, etc., can solve the problems of poor sealing of glass encapsulation bodies, and achieve the effects of improving dose uniformity, improving process adaptability and saving costs.

Active Publication Date: 2020-08-04
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
View PDF12 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In view of this, the object of the present invention is to provide a laser packaging device and packaging method to solve the problem of poor sealing of glass packages

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Laser packaging device and packaging method
  • Laser packaging device and packaging method
  • Laser packaging device and packaging method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0059] The laser packaging device and packaging method proposed by the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. The advantages and features of the invention will be apparent from the claims and the following description. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0060] refer to figure 1 , this embodiment provides a laser packaging device, which can be formed on a packaging substrate such as Figure 4 , Figure 5 As shown in the appearance of the spot, the light intensity from the edge of the spot to the center of the spot on the surface perpendicular to the direction of the laser beam travels gradually decreases. Figure 4 , the light intensity distribution of the spot can be divided into the first section B a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention provides a laser packaging device and a packaging method. The laser packaging device irradiates a laser beam onto a packaging substrate to form a spot. On the surface perpendicular to the direction of the laser beam traveling route, the spot edge reaches the The light intensity at the center of the light spot decreases gradually, the light spot includes a first section close to the edge of the light spot and a second section close to the center of the light spot, and the light intensity decrease ratio of the first section is smaller than the first section The light intensity reduction ratio of the two sections, the boundary position between the first section and the second section is the first inflection point. The encapsulation of the encapsulation substrate by using the laser beam of the light spot provided by the present invention can effectively improve the uniformity of the dose irradiated on the glass frit, and further improve the sealing performance of the frit.

Description

technical field [0001] The invention relates to the field of optoelectronic semiconductors, in particular to a laser packaging device and a packaging method. Background technique [0002] Optoelectronic semiconductor devices have been widely used in various fields of life. Among them, OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) has become a research hot spot due to its good color ratio, wide viewing angle, high response speed and other characteristics, and has a good application prospect. However, electrodes and organic layers in OLED devices are very sensitive to oxygen and moisture. Oxygen and moisture permeating into OLED devices from the external environment will seriously shorten the lifetime of OLED devices. Therefore, it is very important to provide an effective hermetic seal for OLED devices. The hermetic sealing of OLED devices has the following requirements: [0003] The hermetic seal shall provide protection against oxygen (10 -3 cm 3 / ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/20B23K26/06B23K26/073H01L51/52H01L51/56
CPCB23K26/0626B23K26/073B23K26/206H10K59/8722H10K59/875H10K71/421B23K26/06B23K26/20B23K26/0732
Inventor 蓝科戈亚萍
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap