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Parallel coupled photoelectric integration circuit board connector and manufacturing method thereof

A photoelectric integration and parallel coupling technology, which is applied in the coupling of optical waveguides and other directions, can solve the problems of difficult assembly and positioning, complex structure, etc., and achieve the effect of simple structure, convenient use, and rapid positioning and assembly

Active Publication Date: 2018-12-28
苏州席正通信科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a parallel-coupled photoelectric integrated circuit board connector and its manufacturing method to solve the problems of complex structure and difficult assembly and positioning of parallel-coupled photoelectric integrated circuit boards in the prior art.

Method used

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  • Parallel coupled photoelectric integration circuit board connector and manufacturing method thereof
  • Parallel coupled photoelectric integration circuit board connector and manufacturing method thereof
  • Parallel coupled photoelectric integration circuit board connector and manufacturing method thereof

Examples

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Embodiment

[0043] Implementation examples: such as Figure 5 As shown, a parallel-coupled optoelectronic integrated circuit board connector is provided with a waveguide substrate 1 , a waveguide upper cover 13 , an optical fiber array substrate 21 , an optical fiber ribbon 4 , an optical fiber cover 23 , and an array upper cover 24 .

[0044] like Figure 9 As shown, the upper surface of the waveguide substrate 1 is provided with a plurality of waveguides 12, which are assembled into a waveguide array at the edge of the waveguide substrate 1, and the upper surface of the waveguide substrate 1 is provided with a waveguide first groove 11 on both sides of the waveguide array.

[0045]The lower surface of the waveguide upper cover plate 13 is provided with a waveguide second groove 14 corresponding to the position of the first groove 11; the waveguide upper cover plate 13 is connected to the upper surface of the waveguide substrate 1, and the waveguide first groove 11 Together with the sec...

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Abstract

The invention discloses a parallel coupled photoelectric integration circuit board connector and a manufacturing method thereof. The connector comprises a wave guide substrate, a wave guide upper cover plate, an optical fiber array substrate, an optical fiber ribbon, an optical fiber cover plate, an array upper cover plate and a guide pin. The invention also disclosed a manufacturing method of theparallel coupled photoelectric integrated circuit board connector. The parallel coupled photoelectric integration circuit board connector and the manufacturing method thereof effectively realize fastlocation and assembling of the optical fiber array and a photoelectric integrated circuit board, fast connection with other external devices, including photoelectric integrated circuit boards, can berealized by virtue of the connector, and the connector is simple in structure and easy to use.

Description

technical field [0001] The invention relates to the fields of photoelectric integrated circuit boards and the like, in particular to a parallel-coupled photoelectric integrated circuit board connector and a manufacturing method thereof. Background technique [0002] Science and technology in the 21st century are changing with each passing day. As a high-tech industry, the electronics industry is experiencing rapid technological development. At present, with the rapid and comprehensive development of multimedia services, including telephone, cable TV (CATV), digital TV and Internet, the requirements for circuit bandwidth and capacity have increased dramatically. In the traditional field of electricity, the speed of signal transmission and switching has been limited. At present, the transmission speed of the code stream on the telecommunications trunk line has reached dozens or even thousands of Gb / s. In contrast, the bus transmission of the computer still stays at the Gb / S ...

Claims

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Application Information

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IPC IPC(8): G02B6/40G02B6/43
CPCG02B6/40G02B6/43
Inventor 谷丽芳
Owner 苏州席正通信科技有限公司