Laser zoom cutting process for multi-film module
A laser cutting, multi-layer technology, used in laser welding equipment, manufacturing tools, metal processing equipment, etc., can solve problems such as difficulty in effectively improving the narrow frame characteristics of mobile phones
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Embodiment 1
[0034] This embodiment provides a laser zoom cutting process for a multi-layer module, including the following steps:
[0035] 1) Cut the multi-layer module by forward zooming method, such as figure 1 As shown, the multi-film layer module is sequentially composed of a first polyethylene terephthalate layer (PET) 1 with a thickness of 60 μm, a first styrene-acrylonitrile copolymer layer (PSA) 2 with a thickness of 22 μm, A polyimide layer (PI) 3 with a thickness of 20 μm, an optical adhesive layer (OCA) 4 with a thickness of 80 μm, a touch film layer (TSP) 5 with a thickness of 35 μm, and a second styrene-acrylonitrile with a thickness of 15 μm Copolymer layer (PSA) 6, liquid crystal layer (LC) 7 with a thickness of 2 μm, and a second styrene-acrylonitrile copolymer layer (PET) 8 with a thickness of 65 μm; Carry out the first laser cutting, focus the laser with a frequency of 400KHz and an energy of 15W on the surface of POL PET, that is, the surface of the second styrene-acry...
Embodiment 2
[0039] This embodiment provides a laser zoom cutting process for a multi-layer module, including the following steps:
[0040] 1) Cut the multi-layer module by forward zooming method, such as figure 1 As shown, the multi-film layer module is sequentially composed of a first polyethylene terephthalate layer (PET) 1 with a thickness of 50 μm, a first styrene-acrylonitrile copolymer layer (PSA) 2 with a thickness of 25 μm, A polyimide layer (PI) 3 with a thickness of 18 μm, an optical adhesive layer (OCA) 4 with a thickness of 150 μm, a touch film layer (TSP) 5 with a thickness of 20 μm, and a second styrene-acrylonitrile layer with a thickness of 25 μm A copolymer layer (PSA) 6, a liquid crystal layer (LC) 7 with a thickness of 1 μm, and a second styrene-acrylonitrile copolymer layer (PET) 8 with a thickness of 100 μm;
[0041] The first laser cutting is carried out from the front of the multi-layer module, so that the laser with a frequency of 300Khz and an energy of 20W is fo...
Embodiment 3
[0045] This embodiment provides a laser cutting process for a multi-layer module, including the following steps:
[0046] 1) Cut the multi-layer module with forward zooming, such as figure 1As shown, the multi-film layer module is sequentially composed of a first polyethylene terephthalate layer (PET) 1 with a thickness of 75 μm, a first styrene-acrylonitrile copolymer layer (PSA) 2 with a thickness of 13 μm, A polyimide layer (PI) 3 with a thickness of 22 μm, an optical adhesive layer (OCA) 4 with a thickness of 25 μm, a touch film layer (TSP) 5 with a thickness of 50 μm, and a second styrene-acrylonitrile with a thickness of 7 μm A copolymer layer (PSA) 6, a liquid crystal layer (LC) 7 with a thickness of 5 μm, and a second styrene-acrylonitrile copolymer layer (PET) 8 with a thickness of 50 μm;
[0047] The first laser cutting is carried out from the front of the multi-layer module, so that the laser with a frequency of 500KHz and an energy of 10W is focused on the surface...
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