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Laser zoom cutting process for multi-film module

A laser cutting, multi-layer technology, used in laser welding equipment, manufacturing tools, metal processing equipment, etc., can solve problems such as difficulty in effectively improving the narrow frame characteristics of mobile phones

Active Publication Date: 2019-01-04
YUNGU GUAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, cutter wheel cutting and laser cutting are generally used for cutting multi-layer layers. However, due to the special structure of multi-layer layers, it is difficult for existing cutting processes to effectively improve the narrow frame characteristics of mobile phones.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] This embodiment provides a laser zoom cutting process for a multi-layer module, including the following steps:

[0035] 1) Cut the multi-layer module by forward zooming method, such as figure 1 As shown, the multi-film layer module is sequentially composed of a first polyethylene terephthalate layer (PET) 1 with a thickness of 60 μm, a first styrene-acrylonitrile copolymer layer (PSA) 2 with a thickness of 22 μm, A polyimide layer (PI) 3 with a thickness of 20 μm, an optical adhesive layer (OCA) 4 with a thickness of 80 μm, a touch film layer (TSP) 5 with a thickness of 35 μm, and a second styrene-acrylonitrile with a thickness of 15 μm Copolymer layer (PSA) 6, liquid crystal layer (LC) 7 with a thickness of 2 μm, and a second styrene-acrylonitrile copolymer layer (PET) 8 with a thickness of 65 μm; Carry out the first laser cutting, focus the laser with a frequency of 400KHz and an energy of 15W on the surface of POL PET, that is, the surface of the second styrene-acry...

Embodiment 2

[0039] This embodiment provides a laser zoom cutting process for a multi-layer module, including the following steps:

[0040] 1) Cut the multi-layer module by forward zooming method, such as figure 1 As shown, the multi-film layer module is sequentially composed of a first polyethylene terephthalate layer (PET) 1 with a thickness of 50 μm, a first styrene-acrylonitrile copolymer layer (PSA) 2 with a thickness of 25 μm, A polyimide layer (PI) 3 with a thickness of 18 μm, an optical adhesive layer (OCA) 4 with a thickness of 150 μm, a touch film layer (TSP) 5 with a thickness of 20 μm, and a second styrene-acrylonitrile layer with a thickness of 25 μm A copolymer layer (PSA) 6, a liquid crystal layer (LC) 7 with a thickness of 1 μm, and a second styrene-acrylonitrile copolymer layer (PET) 8 with a thickness of 100 μm;

[0041] The first laser cutting is carried out from the front of the multi-layer module, so that the laser with a frequency of 300Khz and an energy of 20W is fo...

Embodiment 3

[0045] This embodiment provides a laser cutting process for a multi-layer module, including the following steps:

[0046] 1) Cut the multi-layer module with forward zooming, such as figure 1As shown, the multi-film layer module is sequentially composed of a first polyethylene terephthalate layer (PET) 1 with a thickness of 75 μm, a first styrene-acrylonitrile copolymer layer (PSA) 2 with a thickness of 13 μm, A polyimide layer (PI) 3 with a thickness of 22 μm, an optical adhesive layer (OCA) 4 with a thickness of 25 μm, a touch film layer (TSP) 5 with a thickness of 50 μm, and a second styrene-acrylonitrile with a thickness of 7 μm A copolymer layer (PSA) 6, a liquid crystal layer (LC) 7 with a thickness of 5 μm, and a second styrene-acrylonitrile copolymer layer (PET) 8 with a thickness of 50 μm;

[0047] The first laser cutting is carried out from the front of the multi-layer module, so that the laser with a frequency of 500KHz and an energy of 10W is focused on the surface...

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Abstract

The invention discloses a laser cutting process for a multi-film module. The laser cutting process comprises the steps that laser cutting is carried out for at least two times on the multi-film moduleto cut the multi-film module, wherein the latter laser cutting is carried out along the cutting mark of the previous laser cutting, and the focal length of laser is different in the process of two adjacent laser cutting. Through the laser zoom cutting, the number of laser single cutting in a film is reduced, and the energy accumulated in the film is reduced, thus the thermal influence on the filmis reduced, and finally the multi-film layer module with a narrow frame is obtained by cutting.

Description

technical field [0001] The invention belongs to the technical field of module cutting, and in particular relates to a laser zoom cutting process of a multi-layer module. Background technique [0002] Judging from the development trend of mobile phones, narrow bezels, thinness, and high screen-to-body ratio have become the items that manufacturers are scrambling to pursue. In terms of narrow bezels, due to the impact of the current lamination equipment accuracy, the distance between OLED AA and Edge is designed to be greater than 1.4mm. [0003] At present, cutter wheel cutting and laser cutting are generally used for cutting multi-film layers. However, due to the special structure of multi-film layers, it is difficult for existing cutting processes to effectively improve the narrow frame characteristics of mobile phones. Therefore, how to provide a multi-layer cutting process to achieve a narrower frame is particularly important. Contents of the invention [0004] Therefo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/40B23K26/08
CPCB23K26/08B23K26/40
Inventor 黄华
Owner YUNGU GUAN TECH CO LTD