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Chip transporting and storing device

A storage device and chip technology, applied in transportation and packaging, packaging, rigid containers, etc., can solve the problems of complex operation, large gap between wafers and slots, and inability to place wafers, and achieve the effect of simple fixing methods

Inactive Publication Date: 2019-01-04
重庆市嘉凌新科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, since the width of the slot is fixed, each slot can only place a wafer with a fixed diameter. If the diameter of the wafer becomes larger, the wafer cannot be placed in the slot. If the diameter of the wafer becomes smaller , the gap between the wafer and the slot is large, the wafer is easy to fall off from the slot, and the slot does not play a limiting role on the wafer
In this way, when storing wafers with different diameters, it is necessary to use boxes of other specifications, and the operation is more complicated

Method used

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  • Chip transporting and storing device
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  • Chip transporting and storing device

Examples

Experimental program
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Embodiment Construction

[0020] The following is further described in detail through specific implementation methods:

[0021] The reference signs in the drawings of the description include: rear plate 1, side plate 2, slot 3, wafer 4, second bending part 5, first bending part 6, fixing part 7, pull cord 8, second Compression spring 9, baffle plate 10, second one-way tooth 11, first one-way tooth 12, first compression spring 13, first protrusion 14, first card hole 15, groove 16, cassette 17, second protrusion 18, the second card hole 19.

[0022] The embodiment is basically as attached Figure 1-Figure 7 shown. The chip transportation and storage device includes a box body, the box body includes a rear panel 1 and two side panels 2, the inner walls of the two side panels 2 are provided with a number of transverse slots 3, and the ends of the two side panels 2 are horizontally Sliding connection on the rear plate 1. combine Figure 5 As shown, the sliding end of the side plate 2 is provided with ...

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PUM

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Abstract

The invention relates to the field of chip processing, and particularly relates to a chip transporting and storing device. The device comprises a box body, wherein the box body comprises a rear plateand two side plates; the end parts of the two side plates are glidingly connected to the rear plate; a plurality of transverse inserting grooves are formed in the inner walls of the two side plates; acover plate comprising a fixing plate and a plurality of bending parts covers the top parts of the two side plates; the bending parts are positioned at two opposite ends of the fixing part; the bending parts adjacent to the fixing part are rotatably connected to the fixing part; every two adjacent bending parts are rotatably connected; and the bending parts can be detacahbly connected to the sidesurfaces of the side plates. According to the abovementioned scheme, the device is capable of storing wafers with different diameters.

Description

technical field [0001] The invention relates to the field of chip processing, in particular to a chip transportation and storage device. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. Wafer is an important raw material for chip processing. For unprocessed wafers, the wafers need to be stored in a box, so as to facilitate the storage and transportation of the wafers. In order to improve the stability of storing wafers in the box, there are several slots inside the box. By inserting the wafers into the corresponding slots, the wafers can be prevented from shaking in the box and the stability of the wafers in the box can be improved. In vivo storage stability. [0003] However, since the width of the slot is fixed, each slot can only place a wafer with a fixed diameter. If the diameter of the wafer becomes larger, the wafer cannot be plac...

Claims

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Application Information

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IPC IPC(8): B65D25/10B65D25/02B65D85/90
CPCB65D25/107B65D25/02B65D2585/86
Inventor 颜文
Owner 重庆市嘉凌新科技有限公司
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