Insulation and thermal conductive nano material based on liquid metal and preparation and application thereof

A liquid metal and nanomaterial technology, applied in the field of thermal conductive materials, can solve the problems of oil seepage and instability of liquid metal insulating thermal conductive adhesive materials, and achieve the effects of high thermal conductivity, expansion of functions and properties, and reduction of corrosion.

Active Publication Date: 2019-01-04
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it should be pointed out that the liquid metal insulating heat-conducting adhesive material prepared by heating, stirring, and oxidation is very unstable, and oil seepage occurs after a period of storage; when it is applied to the surface of heat-dissipating objects, when the thickness of the applied layer becomes thinner, the liquid metal easy to precipitate

Method used

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  • Insulation and thermal conductive nano material based on liquid metal and preparation and application thereof
  • Insulation and thermal conductive nano material based on liquid metal and preparation and application thereof
  • Insulation and thermal conductive nano material based on liquid metal and preparation and application thereof

Examples

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Effect test

Embodiment 1

[0053] The preparation process is as figure 1 , specifically the following steps:

[0054] (1) First, take 0.8ml Span-85 and add it to 150ml absolute ethanol, heat to 60°C and electromagnetically stir for 5-10 minutes to prepare a modifying solution for treating liquid metal surfaces.

[0055] (2) Then take 24mLGa prepared in advance 75.5 In 24.5 Add it into the modified solution, ultrasonic power 100W, ultrasonic 20 minutes each time, ultrasonic three times in total, to obtain a stable dispersed suspension.

[0056] (3) According to the liquid metal and methyl silicone oil 3:1 (volume ratio), add methyl silicone oil (8mL silicone oil in this example) to the liquid metal suspension and heat to 60°C and continue stirring to form a uniformly mixed paste things.

[0057] (4) When most of the absolute ethanol has evaporated, cool the paste to room temperature, put it in a vacuum drying oven, set the temperature at 22°C, and take it out after 12 hours of vacuum exhaust.

[005...

Embodiment 2

[0061] The flow process of embodiment 2 material preparation is as figure 1 , specifically the following steps:

[0062] (1) First, take 0.8ml Span-85 and add it to 150ml absolute ethanol, heat to 60°C and electromagnetically stir for 5-10 minutes to prepare a modifying solution for treating liquid metal surfaces.

[0063] (2) Then take 24ml Ga prepared in advance 75.5 In 24.5 Added to the modified solution and continued to sonicate for 20 minutes, and sonicated three times to obtain a stable dispersed suspension.

[0064] (3) According to the volume ratio of liquid metal and methyl silicone oil of 4:1, add methyl silicone oil to the liquid metal suspension, heat to 60°C and continue stirring to form a uniformly mixed paste.

[0065] (4) When most of the absolute ethanol has volatilized, cool the paste to room temperature, put it in a vacuum drying oven and take it out after vacuum exhausting.

[0066] The microscopic morphology of the material see image 3 , it can be se...

Embodiment 3

[0069] The flow process of embodiment 3 material preparation is as figure 1 , specifically the following steps:

[0070] (1) First, take 0.8ml Span-85 and add it to 150ml absolute ethanol, heat to 60°C and electromagnetically stir for 5-10 minutes to prepare a modifying solution for treating liquid metal surfaces.

[0071] (2) Then take 24ml Ga prepared in advance 75.5 In 24.5 Added to the modified solution and continued to sonicate for 20 minutes, and sonicated three times to obtain a stable dispersed suspension.

[0072] (3) According to the relationship between liquid metal and methyl silicone oil volume ratio of 5:1, add methyl silicone oil to the liquid metal suspension, heat to 60°C and continue stirring to form a uniformly mixed paste.

[0073] (4) When most of the absolute ethanol has volatilized, cool the paste to room temperature, put it in a vacuum drying oven and take it out after vacuum exhausting.

[0074] The microscopic morphology of the material see Figu...

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Abstract

The invention provides an insulation and thermal conductive nano material based on a liquid metal. The material is a silicon material in which liquid metal nanoparticles are dispersed, the volume fraction of the liquid metal in the insulation and thermal conductive nano material is 0.1-90%, and the volume resistivity of the insulation and thermal conductive nano material is greater than and equalto 109 omega.m. The invention also provides the preparation and application of the insulation and thermal conductive nano material. According to the insulation and thermal conductive nano material based on the liquid metal, compared with an existing liquid metal insulation thermal conductive adhesive, functions and properties are further expanded, the corrosiveness of a liquid metal interface material with different base materials, especially aluminum materials, is greatly reduced, and the high thermal conductivity of the liquid metal interface material is maintained.

Description

technical field [0001] The invention belongs to the field of heat-conducting materials, and in particular relates to a heat-conducting material containing liquid metal and its preparation and application. Background technique [0002] With the high integration of electronic chips, electric vehicles and other equipment, the power density of the equipment is increasing. Excessively high power density in a very small space can easily lead to excessive local temperature of the equipment. High temperatures can cause equipment to slow down, devices to fail mid-work, burn people, and many other performance issues. Therefore, for this type of product, it has become one of the crucial challenges in the design to effectively remove the heat generated by high-density power in a space with compact structure and narrow operation. [0003] As we all know, there is a layer of air gap between the electronic components and the heat dissipation equipment. Due to the poor thermal conductivity...

Claims

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Application Information

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IPC IPC(8): C09K5/10
CPCC09K5/10
Inventor 饶伟樊攀刘静王康
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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