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Chip Drying Mechanism

A drying mechanism and chip technology, which is applied in the direction of dryers, drying, local stirring dryers, etc., can solve the problems that water vapor is not easily emitted, affecting processing efficiency and processing quality, so as to reduce the impact of water vapor and ensure Processing quality, the effect of avoiding aging

Active Publication Date: 2020-05-12
泸州龙芯微科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention intends to provide a chip drying mechanism to solve the problem that the water vapor caused by the existing stacked drying structure is not easy to dissipate, which affects the processing efficiency and processing quality

Method used

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Examples

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Embodiment Construction

[0022] The present invention will be further described in detail below through specific implementations:

[0023] The reference signs in the drawings of the specification include: drying slot 1, partition 2, slot 3, cavity 4, heat release hole 5, sliding slot 6, sliding member 7, first wedge 8, second wedge 9. Negative pressure tube 10, sliding sleeve 11, bottom plate 12, telescopic tube 13, lead screw 14, reel 15, draw rope 16, telescopic plate 17, disc body 18, connecting plate 19.

[0024] Implementation example figure 1 with figure 2 Commonly shown: The chip drying mechanism includes a drying tank 1 that opens upwards. The drying tank 1 is provided with parallel and horizontally distributed seven-sided partitions 2 with gaps between adjacent partitions 2 to form slots 3 , The seven-sided partition plate 2 forms a total of six slots 3 for placing and drying the tray 18 with chips mounted on six sides. The partition plate 2 is provided with a cavity 4, and the cavity 4 is equip...

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PUM

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Abstract

The invention relates to the field of chip drying equipment, and discloses a chip drying mechanism. The chip drying mechanism comprises a drying groove opened up; at least two separation plates, transversely distributed in parallel, are arranged in the drying groove; gaps are formed in the adjacent separation plates to form slots; cavities are formed in the separation plates; heat sources are mounted in the cavities; heat releasing holes communicating with the slots are formed in the walls of the cavities; and the separation plates are provided with fixing units for maintaining the distances from chip disc bodies to the separation plates. The chip drying mechanism can solve the quality of influence on the machining efficiency and the machining quality by difficult dissipation of water vapor due to a traditional laminate drying structure.

Description

Technical field [0001] The invention relates to the field of drying equipment for chips, in particular to a chip drying mechanism. Background technique [0002] When processing chips, because the chips are usually small in size, in order to prevent the chips from being lost during the processing, the chips are currently fixed on a larger disk body for processing in a unified manner. The disk body serves as the chip carrier. Provide convenience for chip movement and processing. [0003] In the process of processing the chip, after the chip is etched, the surface of the chip needs to be cleaned to prevent impurities from accumulating on the chip and affecting the processing quality of the chip. After the cleaning is completed, the chip needs to be dried to prevent moisture remaining on the chip from causing corrosion of the chip structure. [0004] The existing drying device for chips is usually a laminated type, that is, the layers of the etched and cleaned disk are stacked and plac...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F26B9/06F26B21/00F26B25/08F26B25/00
CPCF26B9/06F26B21/004F26B25/005F26B25/08
Inventor 黄晓波
Owner 泸州龙芯微科技有限公司
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