Method for processing production test data in semiconductor industry

A technology of data processing and production testing, applied in the field of data processing, can solve problems such as low integration performance, incomplete process data collection, massive data flow back and forth, etc., to achieve the effect of increasing value, improving efficiency, and reducing costs

Active Publication Date: 2019-01-04
成都天衡智造科技有限公司
View PDF12 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Existing test data processing methods, on the one hand, due to the lack of traditional data storage and processing capabilities, the process data collection is incomplete, and the data is not used well in the later stage; on the other hand, even if the test data can be completely collected and stored, due to the The collection of data is often far away from the actual data application requirements, causing massive data to flow back and forth between different systems, the integration performance between systems is low, the depth of data application is low, and the value of data is not fully explored

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for processing production test data in semiconductor industry
  • Method for processing production test data in semiconductor industry

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] The following will clearly and completely describe the technical solutions in the embodiments with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0019] The block diagram of the system module is as follows figure 1 As shown, including the following parts:

[0020] (1) Test data: test data generated by semiconductor equipment or software systems, including test case data, test process data and test result data, etc.;

[0021] (2) Data access: Data access is divided into system-level data SDK, structured data access and unstructured data access. System-level data SDK provides data development tool department, and embe...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to the field of high-speed data acquisition and discloses a method for processing production test data in the semiconductor industry. Through the data architecture, the extraction, modeling analysis and storage of various data including test cases, test process data and test result data generated by an automatic test system can be carried out in a unified way, and a data setwith certain characteristics is formed.

Description

technical field [0001] The invention relates to a data processing method, in particular to a method for processing production test data applied in the semiconductor industry. Background technique [0002] As the concept of Industry 4.0 continues to penetrate into the manufacturing industry, more and more companies regard the digital transformation of the production process as the basis for the current intelligent upgrade of enterprise information. How to make full use of these data and explore the value of data will become an important issue for enterprises Towards the heart of Industry 4.0. [0003] For the semiconductor industry, the testing process is the core link in the production of semiconductor products. Through all-round testing, it is determined whether the product is qualified and whether it can enter the product interaction link. In addition, the semiconductor production output is large and microscopic, so the semiconductor Most of the test procedures use automa...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/26
CPCG01R31/2601
Inventor 杨川李冉
Owner 成都天衡智造科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap