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Manufacture method of display substrate

A technology for display substrates and substrates, which is used in semiconductor/solid-state device manufacturing, organic semiconductor devices, photovoltaic power generation, etc., and can solve the problems of uncontrollable laser ablation slope, high cost and low efficiency of back film lamination process, etc.

Inactive Publication Date: 2019-01-04
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the slope of laser ablation is relatively uncontrollable, resulting in uncontrollable removal effect, the cost of laminating the back film with grooves is high, and the efficiency of the above two methods is relatively low

Method used

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  • Manufacture method of display substrate
  • Manufacture method of display substrate
  • Manufacture method of display substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Such as figure 1 , 3 As shown in 7, this embodiment provides a method for preparing a display substrate, which is especially suitable for the preparation of a flexible OLED display substrate.

[0037] The preparation method specifically comprises the following steps:

[0038] S1, forming a back film material 51 with a first adhesive force on the substrate 4 .

[0039] Among them, the substrate 4 is preferably made of flexible materials, such as polyimide. Specifically, in this step, the back film material 51 with the first adhesive force is formed on the non-display surface side of the substrate 4 (including the peripheral area 3 , the display area 21 , the bending area 22 and the bonding area 23 ). Wherein, the back film material 51 includes a back film 52 base material and a back film 52 adhesive material, and the back film 52 base material is attached to the base 4 through the back film 52 adhesive material. In this embodiment, the back film material 51 is a vari...

Embodiment 2

[0056] Such as figure 2 As shown, this embodiment provides a method for preparing a display substrate, which is basically the same as the method for preparing a display substrate provided in Embodiment 1.

[0057] In particular, in the preparation method of this embodiment, the back film material of the display area and the bonding area is treated first, so that the back film material of the display area and the bonding area changes from the first adhesive force to the second adhesive force. Adhesive force, then cut the back film material along the outline of the display area and the bonding area, and remove the back film material in the peripheral area and the bending area through a peeling process. That is, step S4 is executed first, and then steps S2 and S3 are executed.

[0058] Specifically, the back film material of the display area and the bonding area is treated first, so that the back film material of the display area and the bonding area changes from the first adhe...

Embodiment 3

[0062] Such as Figure 8 As shown, this embodiment provides an apparatus for preparing a display substrate, which is used to prepare a display substrate according to the method for preparing a display substrate provided in Embodiment 1.

[0063] The preparation device of the display substrate comprises: a back film material forming unit, a back film cutting unit, a back film removing unit, a back film adhesion increasing unit, and a substrate cutting unit. in,

[0064] The back film material forming unit is used for forming the back film material with the first adhesive force on the substrate.

[0065] The back film cutting unit is used to cut the back film material along the outline of the display area and the bonding area, so that the back film material in the display area is separated from the back film material in the peripheral area and the bending area, and the back film material in the bonding area It is separated from the back film material in the peripheral area and...

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Abstract

The invention provides a preparation method of a display substrate, belonging to the technical field of display, which can solve the problems of complicated removing process and bad effect of the existing display substrate back film. A method for preparing a display substrate includes forming a back film material having a first adhesive force on a substrate; The substrate includes a substrate region and a peripheral region surrounding the substrate region. The substrate region comprises a display region, a bent region and a bonding region arranged in sequence along the column direction; Cutting the backing film material along the contours of the display area and the bonding area, removing the backing film material of the peripheral area and the bending area by a peeling process, and treating the backing film material of the display area and the bonding area to change the backing film material of the display area and the bonding area from a first adhesive force to a second adhesive force to form a backing film on the substrate; Wherein the second adhesive force is greater than the first adhesive force.

Description

technical field [0001] The invention belongs to the field of display technology, and in particular relates to a preparation method of a display substrate. Background technique [0002] With the development of the display industry, OLED (Organic Light-Emitting Diode; organic electroluminescent diode), as a new type of light-emitting device, has been greatly researched and applied in the field of display technology. At the same time, OLED can be applied to flexible display to achieve low thickness, bending, and full screen narrow frame, etc., which has broad development prospects. [0003] In the prior art, the narrow frame of the lower frame is realized by bending the circuit to the back, and it is necessary to remove the back film in the corresponding bent area on the back film. However, due to the high adhesion between the back film and the substrate, and the narrow bending area, it is difficult to tear off the back film in the bending area. Therefore, the removal of the b...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/683
CPCH01L21/67132H01L21/6836H01L2221/68386H01L2221/68354H10K59/8722H10K71/421Y02E10/549H10K77/111H10K71/851H10K59/87H10K71/00H10K59/00H10K50/84H10K2102/311
Inventor 谷朋浩谢春燕王伟蔡宝鸣
Owner BOE TECH GRP CO LTD
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