A resonant inductively coupled interconnection channel in a 3D-IC

Abstract

The invention discloses a resonant inductively coupled interconnection channel in a 3D-IC includes a transmitting inductor disposed on a transmitting layer and a receiving inductor disposed on a receiving layer; coupling communication between the transmitting layer and the receiving layer is performed through a wireless interconnection channel formed between the transmitting inductor and the receiving inductor; the resonant inductively coupled wireless interconnection channel is formed when the transmitting inductor and the receiving inductor operate in a resonant state. The invention can improve the current voltage gain of the channel, enhance the voltage of the receiving end of the inductively coupled wireless interconnection channel, and reduce the difficulty of system design. The present invention takes two radio inductances operating in a resonant state as the minimum unit in which the method is implemented. Based on its operating frequency, the self-coupled inductance of the inductor cannot be ignored, and the channel transmission performance is enhanced after the introduction of self-coupled inductor. Based on the resonance effect of the inductively coupled wireless interconnection channel, the invention effectively improves the problem of low current and voltage gain in a 3D-IC standard inductively coupled channel.

Description

technical field [0001] The invention belongs to the technical field of 3D-IC inductively coupled wireless interconnection, and more specifically relates to a resonant inductively coupled interconnection channel in a 3D-IC. Background technique [0002] 3D-IC is a new method of system-level architecture, which contains a stack of multiple planar device layers and is interconnected in the vertical direction through through-silicon vias (TSVs). In this way, the size of the chip can be greatly reduced, the transistor density of the chip can be increased, the performance of electrical interconnection between layers can be improved, the operating speed of the chip can be increased, and the power consumption of the chip can be reduced. Introducing the concept of 3D-IC in the design stage, a complete and complex chip can be split into several sub-function chips and implemented in different layers, which not only enhances the chip function, but also avoids the related cost and design...

AI Technical Summary

Problems solved by technology

[0010] Aiming at the defects of the prior art, the purpose of the present invention is to provide a resonant inductively coupled interconnection channel in a 3D-IC, which aims to be compatible with the current standard CMOS process, and solve the problem of short communication distance and short communication distance of the existing standard inductively coupled wireless interconnection channel. The problem of low energy transfer efficiency

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