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A method for embedding a movable object on a large scale using an Internet of Things chip

A technology of IoT chips and mobile objects, which is applied to record carriers, instruments, and computer parts used in machines, and can solve the problem of insufficient human development of mobile phones.

Inactive Publication Date: 2019-01-15
有份儿智慧科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method of using IoT chips to embed movable objects on a large scale, so as to solve the needs of human development only based on mobile phones 10 years later. Our requirement is to set up IoT chips on a large scale On top of all living or non-living objects

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A method for embedding movable objects on a large scale using an Internet of Things chip, comprising an Internet of Things chip, a movable object and a multi-channel carrier of the Internet of Things chip, on which a lower substrate and an embedded substrate are arranged on the multi-channel carrier; further comprising the following steps:

[0024] Step 1: setting a plurality of conductive pins on the lower surface of the lower substrate, implanting solder balls on the upper surface; placing the embedded substrate on the solder balls, and bonding the embedded substrate to the lower substrate through reflow soldering;

[0025] Step 2: Implant solder balls on the upper surface of the embedded substrate, mount one or more IoT chips on the upper surface of the lower substrate in a flip-chip manner and form an electrical connection with the conductive pins of the lower substrate;

[0026] Step 3: Plastic sealing is performed on the upper surface of the lower substrate, and th...

Embodiment 2

[0030] The difference between Embodiment 2 and Embodiment 1 is that the IoT chip is an upper-layer structure chip, and the upper-layer structure chips are placed in the upper-layer structure by stacking, tiling, or a combination of the two, and are wire-bonded, inverted Soldering or a combination of the two, or other methods form an electrical connection with the upper substrate. All or part of the plastic sealant can be replaced by other sealing adhesive materials or filling materials. The upper surface of the lower substrate is implanted with a plurality of fine-pitch solder balls, and the position of the solder balls corresponds to the lower surface of the embedded substrate, and is mirror-symmetrical to the position of the solder balls on the upper surface of the embedded substrate along the middle plane of the embedded substrate. The IoT chip also includes a primary antenna, a secondary antenna, and electronic circuit representations, the antenna being larger than the sec...

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PUM

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Abstract

The invention discloses a method for embedding a movable object on a large scale by using an Internet of things chip, which comprises the following steps: a movable object and a multi-channel carrierof the movable object and the Internet of things chip; a lower substrate and an embedded substrate are arranged on the multi-channel carrier; the movable object and the multi-channel carrier are arranged on the lower substrate and the embedded substrate. The method further comprises the following steps: 1. a plurality of conductive pins are arranged on the lower surface of the lower substrate, andsolder balls are implanted on the upper surface; the embedded substrate is placed on the solder ball, and the embedded substrate is bonded on the lower substrate through reflow soldering. 2, implanting a solder ball on that upper surface of the embed substrate, mounting one or more IOT chips on the upper surface of the lower substrate in a flip-chip man and forming an electrical connection with the conductive pins of the lower substrate; 3, carrying out plastic sealing on that upper surface of the low substrate, filling the plastic sealing adhesive into the gap between the embedded substrateand the lower substrate, and completely covering the flip-chip of the internet of things, the embedded substrate, and the solder balls embedded in the upper side of the substrate.

Description

technical field [0001] The invention belongs to the technical field, and relates to a method for embedding movable objects on a large scale using an Internet of Things chip. Background technique [0002] With the continuous advancement of microelectronics technology, the feature size of integrated circuits continues to shrink, and the interconnection density continues to increase. The future society needs higher-speed information processing and the resulting better mobile product user experience. Packaging technology for circuits presents profound challenges. [0003] The Internet of Things is an information carrier based on the Internet, traditional telecommunication networks, etc., which enables all ordinary physical objects that can be independently addressed to realize interconnection and intercommunication. In the contemporary information society, with the advancement of information technology, the communication between people extends and expands to information exchang...

Claims

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Application Information

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IPC IPC(8): G06K19/077
CPCG06K19/0772G06K19/07745G06K19/07773
Inventor 易霄
Owner 有份儿智慧科技股份有限公司