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ESD protection architecture, integrate circuit and protection method of core circuit thereof

A technology for electrostatic discharge protection and electrostatic discharge, which is used in circuits, electrical components, and electrical solid devices to achieve the effect of high current bearing capacity.

Active Publication Date: 2019-01-15
HIMAX TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, once the ESD current flows into the core circuit before flowing into the clamping circuit, the integrated circuit cannot prevent the core circuit from being damaged by ESD

Method used

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  • ESD protection architecture, integrate circuit and protection method of core circuit thereof
  • ESD protection architecture, integrate circuit and protection method of core circuit thereof
  • ESD protection architecture, integrate circuit and protection method of core circuit thereof

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Embodiment Construction

[0033] Certain terms are used in the specification and subsequent claims to refer to particular elements. It should be understood by those skilled in the art that manufacturers may refer to the same element by different terms. This description and subsequent patent applications do not use the difference in name as the way to distinguish components, but the difference in function of the components as the basis for distinction. "Includes" mentioned throughout the specification and claims is an open-ended term, so it should be interpreted as "including but not limited to". In addition, the term "coupled" herein includes any direct and indirect means of electrical connection. Therefore, if it is described that a first device is electrically connected to a second device, it means that the first device may be directly connected to the second device, or indirectly connected to the second device through other devices or connection means.

[0034] figure 1 It is a functional block d...

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Abstract

An electrostatic discharge protection structure for protecting a core circuit of an integrated circuit from an electrostatic discharge event received by a conductive pad includes a first conductive layer, a clamping element, and a first electrical connection portion electrically connected with a second electrical connection portion. The first conductive layer is formed below the conductive pad andincludes a first conductive portion, an insulating portion and a second conductive portion. The insulating portion is surrounded by the first conductive portion and the second conductive portion. Thefirst conductive portion is electrically connected between the conductive pad and the second conductive portion. The clamping element is used for clamping the electrostatic discharge event. The firstelectrical connection portion is coupled between the first conductive portion of the first conductive layer and the clamping element. The second electrical connection portion is coupled between the second conductive portion of the first conductive layer and the core circuit.

Description

technical field [0001] The present invention relates to electrostatic discharge protection (ESDprotection), in particular to an electrostatic discharge protection architecture that uses a conductive layer floor plan design to protect the core circuit of an integrated circuit from electrostatic discharge events , and related integrated circuits and electrostatic discharge protection methods. Background technique [0002] In order to prevent the core circuit (core circuit) of the integrated circuit from being damaged due to the electrostatic discharge current (ESD current), the integrated circuit uses a clamp circuit disposed therein to clamp the electrostatic discharge current. However, once the ESD current flows into the core circuit before flowing into the clamping circuit, the integrated circuit cannot prevent the core circuit from being damaged by ESD. Therefore, an innovative electrostatic discharge protection mechanism is needed to improve the ability of electrostatic ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/02H01L23/60
CPCH01L23/60H01L27/0248
Inventor 陈鸿毅蔡青霖
Owner HIMAX TECH LTD