A copper clad laminate using inverted copper foil material and a production process thereof

Abstract

The invention discloses a copper clad laminate using an inverted copper foil material, comprises an inverted copper foil material and an etching resist combined with the inverted copper foil material,The inverted copper foil material comprises an insulating layer and a copper layer, wherein the insulating layer is arranged in the middle, the copper layer is covered on both sides of the insulatinglayer, one side of the copper layer is a light surface, and the other side is a wool surface with a roughness greater than the light surface, and the light surface is combined with the insulating layer, and the wool surface faces outward and is combined with an etching resistor. The invention relates to a production process of reversed copper foil material, comprising the following steps: carrying out oxidation resistance treatment on the wool surface of the copper foil layer; The smooth surface of the copper foil and the insulating layer are laminated to form a copper clad laminate; Performrelevant reliability tests; At that pattern transfer process, the wool surface is combined with the etch resist. The inversion copper foil material has the advantages that the bonding force between the copper surface and the etching resistor can be greatly improved through the inversion copper foil material, thereby improving the open circuit and the notch of the inner layer circuit and reducing the defect by 50%.

Description

technical field [0001] The invention relates to the technical field of PCB boards, in particular to an inverted copper-clad copper-clad board. Background technique [0002] With the improvement of customer demand for product functions and the gradual development of small volume, the ordinary PCB line density design in the past can no longer meet the continuously developing product application requirements. In customer product requirements, the distribution of lines on the PCB has gradually changed from a single There are more and more circuit designs, but the existing copper clad laminates are designed to combine the rough surface with the insulating layer, and the smooth surface is combined with the etching resist in the pattern transfer process, which is difficult to meet The demand for new designs has increased the difficulty of the PCB pattern transfer process, and the risk of open circuits and defective gaps has increased. Therefore, it is necessary to improve and opti...

AI Technical Summary

Problems solved by technology

[0002] With the improvement of customer demand for product functions and the gradual development of small volume, the ordinary PCB line density design in the past can no longer meet the continuously developing product application requirements. In customer product requirements, the distribution of lines on the PCB has gradually changed from a single There are more and more circuit designs, but the existing copper clad laminates are designed to combine the rough surface with the insulating layer, and the smooth surface is combined with the etching resist in the pattern transfer process, which is difficult to meet The demand for new designs increases the difficulty of the PCB pattern transfer process, and the risk of open circuits and defective gaps increases

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