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A kind of visual detection machine and detection method for wafer

A technology for inspection machines and wafers, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc. It can solve the problems of blind spots, the inability of operators to fully observe and detect wafers, and block wafers to improve detection accuracy. and the effect on accuracy

Active Publication Date: 2020-11-20
ZING SEMICON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current visual inspection machine carrier will block part of the edge of the wafer, and there is a blind area, so that the operator cannot fully observe and detect the defects of the wafer

Method used

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  • A kind of visual detection machine and detection method for wafer
  • A kind of visual detection machine and detection method for wafer

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Experimental program
Comparison scheme
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Embodiment 1

[0046] In order to solve the aforementioned technical problems, the present invention provides a visual inspection machine for wafers. The visual inspection machine will be further described below in conjunction with the accompanying drawings. figure 1 A schematic structural diagram of a visual inspection machine according to an embodiment of the present invention is shown.

[0047] Specifically, such as figure 1 Shown, the visual inspection machine for wafer of the present invention comprises:

[0048] The stage is used to support and fix the wafer to be tested;

[0049] The mechanical arm 11 is arranged on both sides of the carrier, and is used to grab the wafer to be tested;

[0050] Wherein, the mechanical arm is arranged to rotate around the first axis, the second axis and the third axis, and the extension directions of the first axis and the second axis are two directions perpendicular to each other on the horizontal plane, The extension direction of the third axis is...

Embodiment 2

[0082] The present invention also provides a detection method, which is detected by the visual detection machine described in Embodiment 1.

[0083] Such as figure 2 As shown, the method includes:

[0084] Use the robot arm to grab the wafer to be tested from the carrier for the first time, and rotate the robot arm around the first axis and the second axis to detect the wafer to be tested. round;

[0085] Put the wafer to be tested back on the carrier, and rotate the robot arm along the third axis;

[0086] Use the robot arm to grab the wafer to be tested from the carrier for the second time, wherein the first grab and the second grab the wafer to be tested grabbed by the robot arm The positions of the wafers are different, and then the robot arm is rotated around the first axis and the second axis to detect the wafer to be tested again.

[0087] Optionally, the method also includes:

[0088] Putting the wafer under test back into the carrier after detecting the wafer un...

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Abstract

The invention provides a visual detection machine for wafers and a detection method. The visual detection machine comprises a bearing platform and mechanical arms, wherein the bearing platform is usedfor supporting a wafer to be detected; the mechanical arms are respectively arranged at two sides of the bearing platform and used for grabbing the wafer to be detected; the mechanical arms are arranged in a mode of rotating around a first axial direction, a second axial direction and a third axial direction, the extending directions of the first axial direction and the second axial direction aretwo mutually perpendicular directions on the horizontal plane, and the extending direction of the third axial direction is a vertical direction perpendicular to the horizontal plane. According to thevisual detection machine and the detection method provided by the invention, the mechanical arms realize the rotation around three different directions such as the X-axis, the Y-axis and the Z-axis through different points and tracks. The mechanical arms grab the wafer twice at different positions through the rotation, so that all areas of the wafer can be detected without a blind area, thereby solving a problem that the visual detection machine at present has a dead angle and cannot detect comprehensively, and further improving the detection precision and accuracy.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a visual inspection machine and inspection method for wafers. Background technique [0002] In recent years, semiconductor manufacturing technology has advanced by leaps and bounds. At present, products are thin, light and compact. ICs are getting smaller and stronger, with more and more pins. In order to reduce the area occupied by chip packaging and improve IC performance, flip-chip (FlipChip) packaging is widely used in graphics chips, chipsets, memory and CPU. The unit price of the above-mentioned high-end packaging method is high. If the chip test can be carried out before packaging, if there are defective products in the wafer, they will be marked immediately, and these marked defective products will be discarded before the subsequent packaging process, which can save unnecessary packaging cost. [0003] At present, in the semiconductor industry, the visual inspect...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67288
Inventor 孙瑞何昆哲赵厚莹
Owner ZING SEMICON CORP