Circuit structure of display panel

Abstract

The invention provides a circuit structure of a display panel, which comprises a display area and an output bonding area on one side of the display area. The output bonding area comprises a pluralityof first bonding pads arranged in parallel at intervals and a plurality of first connecting wires located between the adjacent first bonding pads. Each first bonding pad comprises a first bottom pad,a first middle pad and a first top pad. The first bottom pads and the first connecting wires are both located in a first metal layer. The first middle pads are located in a second metal layer. The first top pads are located in a transparent conductive layer. The first metal layer, the second metal layer, and the transparent conductive layer are sequentially stacked, wherein an interlayer insulating layer is arranged between the first metal layer and the second metal layer, and a passivation layer is arranged between the second metal layer and the transparent conductive layer. The problem thatthe first connecting wires between first bonding pins are short-circuited to the first bonding pins when chips are press-fitted can be avoided by arranging the first connecting wires in the first metal layer, thereby improving the process yield and ensuring the product quality.

Description

Technical field [0001] The present invention relates to the field of display technology, and in particular to a display panel circuit structure. Background technique [0002] With the development of display technology, flat display devices such as liquid crystal displays (Liquid Crystal Display, LCD) are widely used in mobile phones, televisions, and personal due to their advantages of high image quality, power saving, thin body and wide application range. Various consumer electronic products, such as digital assistants, digital cameras, notebook computers, and desktop computers, have become the mainstream of display devices. [0003] Most of the liquid crystal display devices currently on the market are backlit liquid crystal displays, which include a liquid crystal display panel and a backlight module. The working principle of the liquid crystal display panel is to place liquid crystal molecules between two parallel glass substrates. There are many vertical and horizontal small ...

AI Technical Summary

Problems solved by technology

[0006] Wherein, the first bonding pad 30' and the second bonding pad 40' are used for bonding (Bonding) driver chip, but as Figure 4 As shown, since the distance between the first bonding pad 30' and the first connection line 31' is very small, and only one layer of passivation layer 95' is covered above the first connection line 31', during bonding, due to the connection Due to poor wire manufacturing process, poor passivation layer coverage, and poor bonding process precision, etc., it is easy to cause the passivation layer 95' to be broken, causing the driver chip to connect the first bonding pad 30' and the first connecting line 31' Connected together, resulting in abnormal drive signal input to the display area, resulting in poor display

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