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High temperature resistant adhesive and its preparation method and composite insulating paper

A composite insulation and adhesive technology, applied in the direction of adhesives, adhesive additives, polymer adhesive additives, etc., can solve the problems of large energy consumption and large pollution

Active Publication Date: 2022-02-08
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Solvent-based polyurethane adhesives are usually used in insulating paper in the prior art. The polyurethane adhesives used have good thermal stability, cohesiveness and flexibility, but this type of adhesive contains a large amount of Organic solvents, large pollution; at the same time, oven drying is required during preparation, so energy consumption is large

Method used

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  • High temperature resistant adhesive and its preparation method and composite insulating paper
  • High temperature resistant adhesive and its preparation method and composite insulating paper
  • High temperature resistant adhesive and its preparation method and composite insulating paper

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preparation example Construction

[0021] The present invention also provides a method for preparing a high-temperature-resistant adhesive, which includes: adding each component of the above-mentioned high-temperature-resistant adhesive into a mixer, and stirring evenly.

[0022] In the method for preparing the high temperature resistant adhesive of the present invention, preferably, the stirring temperature is 70-110°C.

[0023] The present invention also provides a composite insulating paper, the composite insulating paper sequentially includes: a first fiber paper, a polyimide film, a second fiber paper; between the first fiber paper and the polyimide film, the The above-mentioned second fiber paper and the polyimide film are bonded by the high temperature resistant adhesive provided by the present invention.

[0024] In the composite insulating paper of the present invention, preferably, the first fiber paper is one or more of polyaramid fiber paper, polysulfone amide fiber paper, and inorganic fiber paper;...

Embodiment 1

[0031] Based on the total weight of the high-temperature resistant adhesive, 70% by weight of cyanate resin and 3% by weight of polysiloxane-modified cyanate resin were stirred at 90°C; Hydroxyl hyperbranched polysiloxane, 6% by weight of nonylphenol, stirred and mixed evenly at 90° C. to obtain adhesive P1;

[0032] The above adhesive was cooled to 70°C and then coated on both sides of the polyimide film, and then combined with polyaramid fiber paper (Nomex 464 from DuPont Company) and cured at 110°C for 10 hours to obtain composite insulating paper PS1.

Embodiment 2

[0034] Based on the total weight of the high temperature resistant adhesive, 60% by weight of cyanate resin and 5% by weight of polysiloxane modified cyanate resin were stirred at 70°C; Epoxy hyperbranched polysiloxane, 8% by weight of nonylphenol, stirred and mixed evenly at 70°C to obtain adhesive P2;

[0035] The above adhesive was cooled to 50°C and coated on both sides of the polyimide film, and then combined with inorganic fiber paper (TufQUIN110 from 3M Company) and cured at 120°C for 10 hours to obtain composite insulating paper PS2.

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Abstract

The invention relates to a high-temperature-resistant adhesive and a preparation method thereof. The high-temperature-resistant adhesive contains cyanate resin, polysiloxane-modified cyanate resin, a plasticizer and a catalyst. This adhesive uses cyanate resin as the main resin, which has good high temperature resistance; at the same time, this product is a solvent-free adhesive, which does not need to be dried during the process, which can effectively save energy. The invention also provides composite insulating paper prepared from the high-resistant adhesive and its preparation method.

Description

technical field [0001] The invention relates to a high-temperature-resistant adhesive, a preparation method thereof, and composite insulating paper, belonging to the technical field of chemical bonding. Background technique [0002] Insulating paper is usually used as insulating material for various electrical equipment such as cables and coils. In addition to requiring good insulation performance and mechanical strength, a certain degree of high temperature resistance and thermal stability are also required. [0003] Solvent-based polyurethane adhesives are usually used in insulating paper in the prior art. The polyurethane adhesives used have good thermal stability, cohesiveness and flexibility, but this type of adhesive contains a large amount of Organic solvents are more polluting; at the same time, oven drying is required during preparation, so energy consumption is relatively large. Contents of the invention [0004] To solve the above problems, the present inventi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J179/04C09J11/08
CPCC09J11/08C09J179/04C08L2205/08C08L2201/08C08L2205/025C08L2205/03C08L79/04C08L83/06
Inventor 陈小芳周维郭庆勇
Owner BYD CO LTD
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