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Novel TO-220 type semiconductor packaging structure

A TO-220, packaging structure technology, used in semiconductor devices, semiconductor/solid-state device components, electrical solid-state devices, etc., can solve problems such as poor heat dissipation performance, increase the sealing area, improve space utilization, The effect of improving package utilization

Pending Publication Date: 2019-02-12
鑫金微半导体(深圳)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Although the above-mentioned patent documents disclose a partially insulated TO-220 type lead frame, although the semiconductor package reduces the cost and improves the safety, the structure of the package is actually different from that of the traditional TO-220 all-plastic products except for the reason Replace the TO-220 plastic-sealed frame with the traditional TO-220 iron-sealed frame. The internal frame is slightly different in size, but the structure, shape and function are basically similar. It is just that the traditional TO-220 iron-sealed frame is completely encapsulated with plastic sealing compound. The insulation problem of traditional TO-220 iron-sealed frame products, and the surface of the front of the plastic-sealed casing is still a step surface of unequal height, and it is not possible to place more electronic components and semiconductor wafers structurally, which is helpful for realizing Encapsulating more circuit functions does not help, and the metal on the back of the base island part is completely encapsulated by colloid, the heat dissipation performance is not good, and it cannot meet the needs of market development

Method used

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  • Novel TO-220 type semiconductor packaging structure
  • Novel TO-220 type semiconductor packaging structure
  • Novel TO-220 type semiconductor packaging structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] see figure 1 , figure 2 , image 3 , the novel TO-220 type semiconductor packaging structure includes a housing 1, a base island frame 2, and pins 12. The housing 1 is provided with a through hole 11, and the through hole 11 is arranged on the upper end of the housing 1. , the housing 1 includes a colloidal package, the colloidal package of the housing 1 is at least higher than the center point of the through hole 11; the colloidal package and the front surface of the housing 1 are in the same plane, not a stepped surface, The base island frame is arranged in the housing, and the back heat dissipation surface (not shown) of the base island frame 2 is exposed.

[0024] The base island frame 2 is arranged in the casing; the base island frame 2 is provided with at least one inner frame 3, on which an electronic component 4 is arranged, and on the base island frame 2 is also provided with a semiconductor crystal Circle 5, the inner frame 3 on the base island frame 2 and...

Embodiment 2

[0037] see figure 1 , figure 2 , image 3 , the difference from the above-mentioned embodiment is that the pin size of the present invention is the pin size of TO-220 type semiconductor package. Since the present invention utilizes the traditional To-220 frame, the pins and fixing holes of the product can be compatible with the fixing hole positioning and pin installation of the old traditional TO-220, which greatly reduces the user cost.

[0038] Preferably, the typical value of the gap between the pins is 2.54mm.

Embodiment 3

[0040] see figure 1 , figure 2 , image 3 , The difference from the above embodiment is that in this embodiment, the number of said inner frames 3 can be set to 2 or 3 or 5, or even more. Due to the increase in the number of inner frames 3, at the same time, the number of electronic components or wafers placed on the inner frame 3 will also increase, so that more electronic components or wafers are added in the limited space in the semiconductor packaging structure, It can greatly improve the function or effect of semiconductors.

[0041]In this embodiment, control circuits, components or wafers can be loaded on the inner frame 3 , and the electrical connection of some components on the inner frame 3 can be provided. According to actual needs, it can also serve as an electrical connection between the inner frame 3 circuit and the base island frame 2, reducing the amount of metal bonding wires, and reducing the difficulty and complexity of the process. The material of the ...

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Abstract

The invention discloses a novel TO-220 type semiconductor packaging structure, which comprises a shell body, a base island frame, and pins, wherein a through hole is formed in the shell body, and is formed in the upper end of the shell body; the shell body comprises a colloid package; the colloid package of the shell body is at least higher than the center point of the through hole; the colloid package and the front surface of the shell body are in the same plane; the base island frame is arranged in the shell body; and a radiating surface is exposed on the back surface of the base island frame. The invention provides the novel TO-220 type semiconductor packaging structure, a traditional TO-220 iron-packaging frame is utilized, the volume of the base island frame plastic packaging materialcolloid is increased through the packaging colloid, so that more components or semiconductor wafers can be placed in a limited space area of semiconductor packaging, and the heat dissipation performance is maintained.

Description

technical field [0001] The invention relates to the technical field of TO-220 type semiconductor packaging, in particular to a novel TO-220 type semiconductor packaging structure. Background technique [0002] The traditional TO-220 package is fully plastic-encapsulated, because the mounting base island of the heat sink and the wafer are all sealed in the sealing body, and the surface of the sealing shell on the front side of the package is a stepped surface, which leads to the limited available volume of the base island and cannot be installed more Multiple circuits or wafers are packaged inside, and the heat dissipation performance is not good at the same time; while the To-220 iron-sealed product frame is exposed, the heat dissipation performance is good, but because of the limited volume of the packaging gel, the area of ​​the base island where the circuit or wafer can be placed is limited, and cannot Mounting more circuits or wafers makes these two packages generally us...

Claims

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Application Information

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IPC IPC(8): H01L23/31H01L23/495H01L23/367
CPCH01L23/3107H01L23/367H01L23/49568H01L2924/181H01L2924/00012
Inventor 夏乾华
Owner 鑫金微半导体(深圳)有限公司