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Novel high-density installation TO-220 type semiconductor package

A TO-220, high-density mounting technology, used in semiconductor devices, semiconductor/solid-state device components, electrical solid-state devices, etc., can solve the problems of not being able to place more electronic components and semiconductor wafers, and poor heat dissipation performance , to achieve the effect of increasing the available base island, increasing the sealing area, and good heat dissipation

Pending Publication Date: 2021-09-28
鑫金微半导体(深圳)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Although the above-mentioned patent documents disclose a partially insulated TO-220 type lead frame, although the semiconductor package reduces the cost and improves the safety, the structure of the package is actually different from that of the traditional TO-220 fully plastic packaged product except the reason Replace the TO-220 plastic-sealed frame with the traditional TO-220 iron-sealed frame. The internal frame is slightly different in size, but the structure, shape and function are basically similar. It is just that the traditional TO-220 iron-sealed frame is completely encapsulated with plastic sealing compound. The insulation problem of traditional TO-220 iron-sealed frame products cannot place more electronic components and semiconductor wafers in the structure, which is not helpful to help realize the packaging of more circuit functions, and the heat dissipation performance is not good, which cannot meet the needs of market development. need

Method used

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  • Novel high-density installation TO-220 type semiconductor package
  • Novel high-density installation TO-220 type semiconductor package
  • Novel high-density installation TO-220 type semiconductor package

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] see figure 1 , figure 2 , image 3 , the novel high-density mounting TO-220 type semiconductor packaging structure includes a housing 1, a base island frame 2, and pins 12. The housing 1 is provided with a through hole 11, and the through hole 11 is arranged in the housing 1, the housing 1 includes a colloid package, and the colloid package of the housing 1 is at least higher than the center point of the through hole 11; Non-planar design with thin case near pins

[0024] The base island frame 2 is arranged in the housing

[0025] Preferably, the colloid encapsulates the entire casing 1 .

[0026] Because the metal of the traditional TO-220 semiconductor iron seal frame is exposed, users screw and heat sink through the through hole 11. When fixing, insulating rubber particles must be installed in the middle for electrical insulation, which increases installation and material costs.

[0027] And through the sealing around the through hole 11 of the present inventio...

Embodiment 2

[0031] see figure 1 , figure 2 , image 3 , the difference from the above-mentioned embodiment is that the pin size of the present invention is the pin size of TO-220 type semiconductor package. Since the present invention utilizes the traditional To-220 frame, the pins and fixing holes of the product can be compatible with the fixing hole positioning and pin installation of the old traditional TO-220, which greatly reduces the user cost.

[0032] Preferably, the typical distance between the pins is 2.54mm.

Embodiment 3

[0034] see figure 1 , figure 2 , image 3 , and the difference from the above embodiment is that the inner frame 3 of the present invention can be set to 2, 3 or 5, or even more, because the number of inner frames 3 is increased, and at the same time, the inner frame The number of electronic components or wafers on 3 will also increase, so that more electronic components or wafers are added in the limited space of the semiconductor package structure, which can greatly improve the function or effect of the semiconductor.

[0035]The encapsulation structure of the present invention increases the encapsulation area of ​​the encapsulation body to the original exposed part on the basis of the encapsulation of the traditional To-220 type semiconductor iron seal frame, and basically covers most of the area of ​​the front of the frame to expand the area of ​​the base island for encapsulation, covering The upper part of the colloid is at least higher than the center point of the thr...

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Abstract

The invention discloses a novel high-density installation TO-220 type semiconductor package structure which comprises a shell, a base island frame and pins, wherein a through hole is formed in the shell, the through hole is formed in the upper end of the shell, the shell comprises a colloid package, the colloid package of the shell is at least higher than the center point of the through hole, the base island frame is arranged in the shell, metal on the back face of the base island metal frame is exposed to facilitate heat dissipation, the shell on the front face is in a step form, and the shell close to the step of the through hole is thinner than the shell close to the pin. According to the novel high-density installation TO-220 type semiconductor package structure, the colloid area of the base island frame is increased, more elements or semiconductor wafers can be placed in the limited space area of semiconductor package, heat dissipation during product working is facilitated, and meanwhile, a user can lock screws to fasten a radiator conveniently.

Description

technical field [0001] The invention relates to the technical field of TO-220 type semiconductor packaging, in particular to a novel high-density mounting TO-220 type semiconductor packaging structure. Background technique [0002] The traditional TO-220 package is fully plastic-sealed, because the mounting base island of the heat sink and the wafer are all sealed in the sealing body, firstly, the frame is smaller than the traditional TO-220 iron seal, resulting in the limited volume of the base island, and the sealing height is not high One also affects the base island area available for the frame, so that more circuits or wafer packages cannot be installed, and the heat dissipation performance is not good; while the To-220 iron-sealed product frame is exposed, the heat dissipation performance is good, but because of the volume of the packaging colloid Limited, the base island area where circuits or wafers can be placed is limited, and more circuits or wafers cannot be inst...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L23/495H01L23/04
CPCH01L23/3107H01L23/49575H01L23/49568H01L23/4952H01L23/49586H01L23/04H01L2224/48137
Inventor 夏乾华曾志敏
Owner 鑫金微半导体(深圳)有限公司