Breaking piece conveying mechanism and small breaking piece device

Abstract

The invention relates to a breaking piece conveying mechanism and a small breaking piece device. The braking piece conveying mechanism comprises a supporting seat, a conveying platform, a precision positioning module and a motor. The precision positioning module is arranged on the supporting seat; the conveying platform is fixedly connected with the top of a sliding block of the precision positioning module; the motor is used for driving the sliding block of the precision positioning module to perform reciprocate linear movement on the conveying platform in the horizontal direction; and a plurality of vacuum adsorption holes are formed in the conveying platform, one ends of the vacuum adsorption holes communicate with the external environment by penetrating through the top of the conveyingplatform, and the other ends of the vacuum adsorption holes are connected with vacuum suction equipment in an air line mode. The small breaking piece device is provided with the braking piece conveying mechanism. The braking piece conveying mechanism has the beneficial effects that transportation is smooth, piece scattering can be avoided, chippings on the conveying platform are reduced and the probability of next round products being scratched the next round is reduced.

Description

technical field [0001] The invention relates to the technical field of conveying mechanisms, in particular to a split conveying mechanism and small split equipment. Background technique [0002] In the prior art, it is often necessary to split the entire piece of material. For example, in the manufacturing process of glass or silicon wafers, it is necessary to use a laser scribing machine to cut the entire piece of glass or silicon into pieces. small pieces. Laser scribing is the use of high-energy laser beams to irradiate the entire glass or silicon wafer surface, so that the irradiated area is partially melted and vaporized, so as to achieve the purpose of scribing. However, in the above-mentioned laser cutting process, in order to prevent the laser from damaging the cutting platform, the glass or silicon wafer will not be cut directly according to the cutting line. Usually, after the scribing, there will be a splitting process to cut the scribed The whole piece of glass...

AI Technical Summary

Problems solved by technology

[0004] However, when using the existing ordinary conveying mechanism to transfer the product, especially in the process of conveying the broken pieces, there is a problem that the product is easy to scatter, and thus tilts or even falls relative to the conveying platform; in addition, in When the products are fragile products such as glass or silicon wafers mentioned above, there is a problem that the products are easy to generate debris on the conveying platform, which will cause scratches to the products transported in the next round

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