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Diode injection molding material crushing machine

A diode and injection molding technology, applied in the field of diode injection molding machine, can solve the problems of production and processing influence, low efficiency, diode lead damage, etc., to achieve efficient removal, increase production and processing efficiency, and reduce workers' work intensity.

Pending Publication Date: 2019-02-22
安徽瑞翔电子科技有限公司
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  • Claims
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AI Technical Summary

Problems solved by technology

There is an injection molding step in the diode processing process. Due to the problem of the injection molding process, injection molding waste will remain between the two adjacent diodes in the diode group after the injection molding step. The injection molding waste is located on the side of the two adjacent diodes close to the diode body. Between the leads, these injection molding wastes will stick to two adjacent diode leads, which will affect the subsequent production and processing
[0003] The existing method is manual removal by workers, which is not only inefficient, but also may cause damage to the diode leads

Method used

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  • Diode injection molding material crushing machine
  • Diode injection molding material crushing machine
  • Diode injection molding material crushing machine

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Embodiment Construction

[0031] see Figure 1-Figure 9 , Diode injection molding machine;

[0032] It includes a bottom plate 1, a movable plate 2, and a top plate 3 arranged horizontally from bottom to top. There are several vertically arranged support columns 4 between the bottom plate 1 and the top plate 3. The movable plate 2 corresponds to each support column 4 in position. A through hole matching the support column 4 is provided, the movable plate 2 is slidably matched with the support column 4, a vertical cylinder 5 is provided in the middle area of ​​the top plate 3, the fixed end of the cylinder 5 is fixedly connected with the lower side of the top plate 3, and the cylinder 5 The movable end is fixedly connected to the upper side of the movable plate 2;

[0033] The upper side of the bottom plate 1 is provided with diode positioning seats 6 arranged horizontally and arranged in a determinant (2*3 arrangement in this embodiment). From one side to the other side, it is divided into a first pa...

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Abstract

A diode injection molding material crushing machine comprises a bottom plate, a movable plate and a top plate, all of which are sequentially arranged from bottom to top. Supporting columns are arranged between the bottom plate and the top plate and are in sliding fit with the movable plate. An air cylinder is arranged between the top plate and the movable plate. Diode positioning bases arranged ina line-row manner are arranged on the upper side of the bottom plate and provided with diode containing areas and lead whisking and containing areas. The position, corresponding to each lead whiskingand containing area, of the lower side of the movable plate is provided with a pressing strip, and the pressing strips are connected with the movable plate through springs. The positions, corresponding to the injection molding residue positions, of the lower side of the movable plate are provided with material crushing strips, the material crushing strips are provided with rectangular grooves forthe leads to penetrate, and the two pressing strips are flush to the lower sides of the material crushing strips. By means of the material crushing machine, waste generated through the diode injection molding technology can be efficiently removed from the adjacent diode leads in a batched manner.

Description

technical field [0001] The invention relates to the technical field of diode processing, in particular to a diode injection molding machine. Background technique [0002] When processing diodes, generally a number of diodes arranged in parallel on the same horizontal plane are arranged at equal intervals along the width direction of the diodes, and are positioned by a strip-shaped material rack to form a strip-shaped diode group, and then press the group for processing. There is an injection molding step in the diode processing process. Due to the problem of the injection molding process, injection molding waste will remain between two adjacent diodes in the diode group after the injection molding step. The injection molding waste is located on the side of the two adjacent diodes close to the diode body. Between the leads, these injection molding wastes will stick to two adjacent diode leads, which will affect the subsequent production and processing. [0003] The existing...

Claims

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Application Information

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IPC IPC(8): B29C45/17
CPCB29C45/1769Y02P70/50
Inventor 丁宁张忠革丁甸庄磊丁延柏刘传让武锋
Owner 安徽瑞翔电子科技有限公司
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