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A Design Method for Embedded Platform Molded Line of Hull Deck Surface

A design method and platform-type technology, applied in ship design, ship construction, ship components, etc., can solve the problems of too large modification area, low approval rate, sharp disappearance of square edges and corners, etc.

Active Publication Date: 2020-10-20
CSSC HUANGPU WENCHONG SHIPBUILDING COMPANY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Although this method avoids the passive action of grabbing the landing platform on the spot, and therefore eliminates the major rework risk of the deck needing to be disassembled and reinstalled due to substandard flatness requirements in the later stage, however, this method also has The disadvantages of modifying the area are too large, the mold line changes too much, and the square edges and corners disappear are too sharp, which leads to a low approval rate, and easily leads to losses after the deck is formed because the performance of the deck is not up to standard with the original design.

Method used

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  • A Design Method for Embedded Platform Molded Line of Hull Deck Surface
  • A Design Method for Embedded Platform Molded Line of Hull Deck Surface
  • A Design Method for Embedded Platform Molded Line of Hull Deck Surface

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Embodiment Construction

[0026] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0027] refer to Figure 1 to Figure 4 , the present embodiment provides a design method for embedding the deck surface of a hull into a platform molding line, comprising the following steps:

[0028] a. On the plan view of the deck line, draw a circle O with the midpoint of the deck centerline 1 as the center and refer to the radius of the landing platform, wherein the radius of the circle O is the radius of the circular landing platform, and the circle O intersects with deck centerline 1 at points A and B;

[0029] b. Project point A and point B in the plan view onto the deck center line 1 in the side view, and connect the line segment AB of point A and point B. The lin...

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Abstract

The invention relates to the technical field of manufacturing a ship, specifically relates to a design method of a ship deck embedding platform molded line; the invention is designed through geometricconstruction, so the invention is simple and easy; the completed molded line conforms to the code requirement; through applying the molded line, a landing platform meeting the flatness requirement can be not only obtained, but also the smooth deck can be obtained; due to small total modification amount, the influence on the deck performance is limited, so that the audit passing rate is great; andsolid guarantee can be provided to the segmented manufacturing of the ship deck and final assembly of a shipway.

Description

technical field [0001] The invention relates to the technical field of hull manufacturing, in particular to a design method for embedding a deck surface of a hull into a platform molding. Background technique [0002] The embedding of the helicopter landing platform on the deck surface of the hull will inevitably cause changes in the shape of the deck surface. The deck line must be modified to ensure the levelness of the landing platform on the one hand and the smoothness of the deck surface on the other hand. At present, one of the methods for embedding the helicopter landing platform is to pre-participate in the three-way smoothing of the deck line in the form of a square straight plate. [0003] Although this method avoids the passive action of grabbing the landing platform on the spot, and thus eliminates the major rework risk that the deck needs to be disassembled and re-installed due to substandard flatness requirements in the later stage, but this method also has The...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B63B71/00
CPCB63B71/00
Inventor 刘元斌
Owner CSSC HUANGPU WENCHONG SHIPBUILDING COMPANY