Molded air cavity packages and methods for production thereof

Abstract

Molded air cavity packages and methods for producing molded air cavity packages are disclosed. In one embodiment, the molded air cavity package includes a base flange; retention posts integrally formed with the base flange and extending from the flange frontside in a direction opposite the flange backside; and retention tabs having openings through which the retention posts are received. A moldedpackage body is bonded to the base flange and envelopes, at least in substantial part, the retention posts and the retention tabs. The molded air cavity package further includes package leads extending from the molded package body. In certain implementations, the package leads and the retention tabs comprise singulated portions of a leadframe. Additionally or alternatively, the retention posts maybe staked or otherwise physically deformed in a manner preventing disengagement of the retention posts from the retention tabs along a centerline of the molded air cavity package.

Description

technical field [0001] Embodiments of the present invention relate generally to microelectronic packages, and more specifically, to molded air cavity packages and methods of producing the same. Background technique [0002] Air cavity packaging is effectively used to house semiconductor die and other microelectronic devices precisely those that support RF functionality. Air cavity packages are manufactured in a variety of different ways, with varying benefits and disadvantages associated with different manufacturing methods. In a common method for manufacturing leaded air cavity packages, a separately manufactured piece, often referred to as a "window frame," is bonded between the package leads and the base flange. The window frame is made of a dielectric material such as ceramic to provide electrical insulation between the base flange and the package leads. The window frame may have a rectangular platform geometry and a central opening that defines the outer perimeter of ...

AI Technical Summary

Problems solved by technology

Despite these advantages, several limitations continue to hinder the process for making molded air cavity packages as routinely performed

Such limitations may often relate to difficulties in maintaining precise alignment between package components prior to and / or throughout the molding process

Additionally, in the case of conventional molded air cavity package manufacturing processes, it can be difficult to ensure a reliable, high integrity seal between bonded components, which in some applications is critical to maintaining air cavity integrity throughout the life of the package. Hermetic environment can be critical

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