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Electrostatic suction cup refurbishing tooling and refurbishing method thereof

An electrostatic chuck and tooling technology, which is used in manufacturing tools, grinding drives, metal processing equipment, etc., can solve problems such as process difficulties and electrostatic chuck damage, and achieves the ability to eliminate force differences, uniform force, and not easy to accidentally scratch. Effect

Active Publication Date: 2019-03-05
ADVANCED MICRO FAB EQUIP INC CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Routinely, this process requires disassembly of the electrostatic chuck, which is difficult and can cause irreparable damage to the electrostatic chuck

Method used

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  • Electrostatic suction cup refurbishing tooling and refurbishing method thereof
  • Electrostatic suction cup refurbishing tooling and refurbishing method thereof

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Embodiment Construction

[0026] The present invention will be further elaborated below by describing a preferred specific embodiment in detail in conjunction with the accompanying drawings.

[0027] Such as figure 1 As shown, the electrostatic chuck 1 is a disc with a convex cross section. Made of plastic POM (a kind of engineering plastic), it has the characteristics of high hardness, high rigidity and high wear resistance. The raised convex surface in the middle is used to fix the wafer to be etched, and the polymer generated during etching accumulates on this surface. A slightly lower portion around the circle is provided with threaded holes for fixing the support seat 3 in this embodiment. On the outer edge of the convex surface of the electrostatic chuck 1, there is a ring-shaped sealing protection tape 11 with a ring width of a. The sealing protection tape 11 plays a role of sealing when etching the wafer, and prevents the halogen-based plasma gas used in etching from escaping. Therefore, th...

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Abstract

The invention discloses an electrostatic suction cup refurbishing tooling and a refurbishing method thereof. According to the electrostatic suction cup refurbishing tooling and the refurbishing methodthereof, the tooling is arranged on an electrostatic suction cup and used for refurbishing of the upward convex surface of the electrostatic suction cup to remove accumulated polymer, the outer edgeof the upward convex surface of the electrostatic suction cup is provided with an annular seal protection band, the tooling comprises a polishing device and a supporting seat, wherein the polishing device adopts a planetary gear structure which comprises a driving gear, a planetary gear and an inner gear, the lower portion of the planetary gear is coaxially connected with a polishing grinding disc, the polishing grinding disc is in close fit with the upward convex surface of the electrostatic suction cup, in working, the driving gear performs autogiration to drive the planetary gear to performrevolution and the autogiration, so that the polishing grinding disc is made to also perform compound motions of the revolution and the autogiration to perform polishing on the accumulated polymer onthe upward convex surface of the electrostatic suction cup; and the supporting seat is arranged between the electrostatic suction cup and the polishing device, and center alignment stacking and fixing are performed according to the order of the electrostatic suction cup, the supporting seat and the polishing device from bottom to top. By means of the electrostatic suction cup refurbishing toolingand the refurbishing method thereof, the problems of non-constant force supplying and uneven and not smooth polished surface polishing in pure manual electrostatic suction cup refurbishing are solved.

Description

technical field [0001] The invention relates to the technical field of plasma etching, in particular to an electrostatic chuck refurbishment tool and a refurbishment method thereof. Background technique [0002] In the industrial field of manufacturing IC chips, electrostatic chuck devices are widely used in the process of processing semiconductor wafers. Since highly reactive F, Cl and other halogen-based plasmas are commonly used in etching wafers, these plasmas will produce polymers (Polymer) while etching wafers, and gradually cover the surface of the electrostatic chuck (ESC). surface. After long-term accumulation, a large number of polymers accumulate on the surface of the electrostatic chuck, which reduces the performance of the chuck. [0003] When an electrostatic chuck loses its electrostatic holding capacity due to excessive use, it is necessary to refurbish the electrostatic chuck. Routinely, this process requires disassembly of the electrostatic chuck, which ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B29/02B24B1/00B24B47/12
CPCB24B1/00B24B29/02B24B47/12
Inventor 杨金全徐朝阳雷仲礼
Owner ADVANCED MICRO FAB EQUIP INC CHINA
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