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Conductive network wire pattern structure and manufacturing method thereof

A manufacturing method and technology of conductive mesh, which are applied in cable/conductor manufacturing, conductive layer on insulating carrier, equipment for manufacturing conductive/semiconductive layer, etc., can solve the problem of reduced touch sensing amount and large metal grid spacing , less than the induction signal and other problems, to achieve the effect of improving the application product

Active Publication Date: 2020-07-03
CHIA SHENG TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] However, the above-mentioned technologies are in mass production, and there are still many problems to be overcome. (1) To make the metal lines invisible, the width of the metal lines may have to be less than 5um, which requires high-precision equipment; (2) In order to achieve users can Accepted 98% light transmittance, the sensing area should be reduced by 98%, and the relative touch sensing volume may also be reduced by 50 times; (3) The spacing of the metal grid is too large, and the mutual capacitance is too small to measure the sensing signal

Method used

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  • Conductive network wire pattern structure and manufacturing method thereof
  • Conductive network wire pattern structure and manufacturing method thereof
  • Conductive network wire pattern structure and manufacturing method thereof

Examples

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Embodiment Construction

[0042] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the present invention and implement it, but the examples given are not intended to limit the present invention.

[0043] Please refer to figure 1 , which is a schematic diagram of the conductive mesh wire pattern structure 100 of the present invention. A conductive mesh pattern structure 100 proposed by the present invention includes: a plurality of conductive mesh lines 122 formed on a transparent substrate 110 . The corresponding barrier pattern layer 132 is disposed on some of the conductive mesh wires 122 . Its main feature is that the barrier pattern layer 132 can have different heights or the same height. That is, the barrier pattern layer 132 has a height difference. On the transparent substrate 110, there is part of the conductive pattern at the same time, for example figure 1 In a ...

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Abstract

The invention provides a conductive network line pattern structure and a manufacturing method thereof. The conductive network line pattern structure comprises a plurality of conductive network lines formed on a transparent substrate; barrier pattern layers are arranged on part of the conductive network lines in the conductive network lines; and the barrier pattern layers have different heights. The barrier pattern layers are preferably formed by a nano-imprinting manufacturing process. The invention further provides the manufacturing method of the conductive network line pattern structure. Theconductive network lines with the nanoscale line widths and low light reflection can be obtained.

Description

technical field [0001] The present invention relates to a conductive mesh pattern structure, in particular to a conductive mesh pattern structure and a manufacturing method using nanoimprinting to form photoresist with different heights. Background technique [0002] In the 1960s, Heilmeier and others from RCA Corporation (Radio Corporation of America Corporation) developed liquid crystal displays, creating a new era of digital display. Because liquid crystal displays have the advantages of thinness, portability, and low power consumption, they are mass-produced along with the vigorous development of various digital electronic products. In the 1970s, people developed touch technology that can determine the location, allowing people to input specific information by pressing the location. By interleaving the two electric fields perpendicular to each other, the position of the touch point can be identified through the signal difference at the interlaced position during touch s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B5/14H01B13/00G06F3/044G06F3/041
CPCG06F3/0412G06F3/044G06F2203/04103G06F2203/04112H01B5/14H01B13/0026
Inventor 许博义邱见泰林昱祯朱世杰
Owner CHIA SHENG TECH
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