Method for plugging hole of PCB by employing electrophoresis resin

Abstract

The invention relates to a method for plugging a hole of a PCB by employing electrophoresis resin. The method comprises the following steps of plating metal copper in thickness required by a finishedproduct in a hole by an electroplating mode after drilling of a circuit board so as to form the whole conductive board; pasting light-sensitive films on an upper surface and a lower surface of the board, exposing a hole needed to be resin-plugged by employing an image film, covering the other places with the light-sensitive films; handing the board on an electrophoresis tank positive electrode forelectrophoresis, and performing hole filling and electroplating by epoxy electrophoresis resin; removing the light-sensitive film on a board surface with sodium hydroxide; performing high-temperaturesegmented baking on the board; and polishing the board surface by a non-woven polishing-brushing machine, leveling resin higher than a hole surface until no influence is generated on appearance, andfinally obtaining the PCB. By the method, the problem that the flatness and the saturation cannot be ensured due to the adoption of silk-screen printing in industry can be solved, the problem that theplug hole is not opaque cannot be ensured by 100% is solved, and the cost is substantially reduced.

Description

technical field [0001] The invention relates to a method for plugging holes with electrophoretic resin on a PCB board, belonging to the field of PCB board manufacturing. Background technique [0002] At present, in the process of PCB preparation, the use of screen printing cannot guarantee the flatness and fullness, and at the same time, it cannot solve the problem of ensuring 100% plug holes are opaque. [0003] In the PCB preparation industry, the cost of resin plug holes is 250 yuan / square meter, which is relatively high. [0004] Therefore, it is necessary to design a PCB board using electrophoretic resin plugging method to overcome the above problems. Contents of the invention [0005] The purpose of the present invention is to overcome the defects of the prior art and provide a method for plugging holes with electrophoretic resin on PCB boards, which is easy to operate and high in production efficiency, and can solve the problem that the industry cannot guarantee fl...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the defects of the prior art and provide a method for plugging holes with electrophoretic resin on PCB boards, which is easy to operate and high in production efficiency, and can solve the problem that the industry cannot guarantee flatness and plumpness by screen printing. Solve the problem that the industry cannot guarantee 100% plug holes are opaque; and the cost is greatly reduced